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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

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    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

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Wk 33 Electronics Supply Chain Digest

31.8.2026
Reading Time: 4 mins read
A A


Electronics Supply Chain Weekly Digest 8-21-26.

DATAPOINT OF THE WEEK: U.S. new-vehicle sales are tracking to a 16.3M SAAR in August, flat M/M and roughly 200k below last August’s pace, according to Cox Automotive.

RelatedPosts

Wk 35 Electronics Supply Chain Digest

Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Volume is forecast at 1.35M units, down 8.5% Y/Y, with most of the decline attributable to calendar effects rather than demand deterioration: August 2026 carries fewer selling days, and Labor Day shifts into September this year versus falling inside the August reporting period last year.

The comp is further distorted by pull-forward ahead of the $7,500 federal EV tax credit expiration in September 2025. Cox attributes the steady SAAR to a buyer mix skewed toward higher-income households with stronger credit and cash reserves, which are less exposed to rate and inflation pressure than the broader consumer.

Headlines:

Auto/Transportation

  • Automakers pivot ADAS spending to advanced Level 2 as Mercedes-Benz, BMW pause Level 3 rollouts, as reported by Capgemini and SBD Automotive
  • Honda may skip eighth North American assembly plant without USMCA extension
  • President Trump threatens 50% tariff on Canadian cars, trucks, auto parts, and steel effective January 1
  • VW announces largest restructuring in company history as works council warns trust in CEO is damaged
  • Waymo announces Munich autonomous vehicle testing ahead of planned Germany robotaxi launch in late 2027
  • Xpeng guides 3Q revenue below expectations and posts wider 2Q loss as China EV price competition intensifies

Datacenter

  • JPMorgan reportedly leads $5B debt package to fund Volta Infra’s AI datacenter buildout, as reported by Bloomberg
  • OpenAI datacenter head Chris Malone has reportedly departed amid broader leadership exodus ahead of expected 2027 IPO, according to WSJ

Connectivity

  • Marvell’s raised FY28 outlook underwhelms despite 37% Y/Y revenue growth in F2Q

Industrial

  • Carrier considers Fort Worth for ~$434M chiller plant to meet surging datacenter cooling demand
  • President Trump signs executive order banning some foreign-made equipment from US electricity grid, citing national security risk

Semiconductors

  • Advantech integrates Intel Core Ultra Series 3 processors across its motherboard, module, and edge computer lineup
  • Kodiak AI announces AMD EPYC CPUs as compute platform for seventh-gen driverless truck system
  • Anthropic reportedly commits $45B to rent Nvidia Vera Rubin capacity from Nscale’s West Virginia campus, as reported by Bloomberg
  • Arduino announces VENTUNO Q edge AI board pre-orders on Qualcomm Dragonwing IQ8, with SECO and Toradex lined up for production SOMs
  • AWS commits to deploying 2M additional Nvidia GPUs through 2027-2028 as demand outpaces prior forecasts
  • Google TPU v10 reportedly moving to multi-vendor design with MediaTek seen as likely lead integrator, according to DigiTimes
  • Infineon announces acquisition of C2i Semiconductors to expand AI datacenter power management portfolio
  • Kioxia and Sandisk announce $31B Japan memory investment through 2032, anchored by new northern Japan fab
  • Lam Research announces Oregon lab expansion, adding 50% more cleanroom space for etch development and hardware validation
  • Meta unveils MTIA 300 training chip with built-in networking that cuts recommendation-model communication time 3.9x vs traditional GPU clusters
  • SEMCO raises MLCC prices signaling broader MLCC upcycle, according to TrendForce
  • Navitas Semiconductor announces acquisition of Claros for up to $232.8M to add VPD and IVR technology for AI datacenters
  • Nvidia reportedly pauses revenue-sharing deals with AI cloud firms amid antitrust and control concerns, as reported by WSJ
  • Nvidia guides FY28 revenue growth above 70% on Rubin ramp as F3Q27 outlook runs past expectations
  • OpenAI announces first Jalapeño inference chip results showing 1.5x-1.9x higher performance per watt vs commercial AI systems
  • SK Hynix sees global memory chip shortage running through end of 2030 as CEO dismisses oversupply risk
  • SK Hynix breaks ground on $4B Indiana HBM packaging and AI R&D site to sit closer to US customers
  • Trump administration weighs new semiconductor tariffs that could extend to laptops, gaming consoles, and datacenter servers, according to Politico

Consumer

  • Apple’s foldable iPhone debut will rescue the category from decline and take 40% share in 2027, per IDC
  • SpaceX announces plans for $100B Starbase Louisiana complex as its fourth and largest US launch site
  • Xiaomi unveils Xring O3 smartphone processor reportedly built on TSMC 3nm as in-house silicon push extends to AI and autonomous driving chips, per Reuters

Related

Source: Edgewater Research

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