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    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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    High Voltage MLCCs Meeting the Growing Demand for Efficiency in Power Conversion

    Bourns Releases High Power High Ripple Chokes

    KYOCERA AVX Releases Hermaphroditic WTW and WTB Connectors

    Radiation Tolerance of Tantalum and Ceramic Capacitors

    TDK Releases Compact Polypropylene Film Capacitors for Resonant Topologies

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    Würth Elektronik Offers Accessory Humidity Sensor Filter Cap

    Knowles Unveils High-Performance Safety-Certified MLCC Capacitors

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    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

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    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

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    Inductor Resonances and its Impact to EMI

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TDK Expands MLCCs Metal Frames Modules for Automotive

10.9.2024
Reading Time: 2 mins read
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TDK Corporation has extended the automotive-grade CA series of its MEGACAP MLCCs modules with a metal frame. Mass production of the product series began in September 2024.

In recent years, the development of automobiles with electric powertrains, such as hybrid- (HEVs) and battery-electric vehicles (BEVs), and highly efficient charging technologies, has significantly progressed. Both help to reduce greenhouse gas emissions.

RelatedPosts

TDK Releases Compact Polypropylene Film Capacitors for Resonant Topologies

TDK Announced Wide Frequency Automotive Wirewound POC Inductors

TDK Presents Various Large-Size Ferrite Cores for Industrial Applications

In these applications, the power consumption of various subsystems including inverters, onboard chargers (OBCs), and wireless power transfer (WPT) systems is increasing, and MLCCs ceramic capacitors must handle high ripple currents and have large capacitance.

To meet these needs, TDK developed the CA series, the largest MLCCs modules in the industry (6.00 x 5.60 x 6.40 mm) with a metal frame and 3-line type structure. TDK now provides an extensive lineup including 99 nF/1000 V with a Class 1 dielectric and 47 μF/100 V with a Class 2 dielectric.

To handle high currents, TDK has reduced the equivalent series resistance (ESR) compared to the previous products by optimizing the materials of the metal frame. This helps reduce the number of components and miniaturizes devices. TDK will further expand its lineup to meet the needs of customers.

Features

  • Low resistance achieved by optimizing metal frame materials
  • High capacitance achieved using multiple MLCCs to help reduce the number of components and miniaturizing devices
  • High reliability qualified based on AEC-Q200

Applications

  • Smoothing and decoupling of the power lines
  • Resonant circuits in subsystems such as OBCs and WPTs
  • Snubber circuits in inverters

Related

Source: TDK

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