Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

    SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

    SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
Reading Time: 6 mins read
A A
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata will introduce isolated gate-drive power converters and integrated inertial sensors at electronica 2026, alongside demonstrations spanning robotics, automotive sensing, wireless tracking and wearable interfaces.

The exhibition takes place on 10–13 November at Messe München, with Murata exhibiting in Hall C4, Booth 179.

RelatedPosts

Murata World First 008004 NTC Thermistors for Temperature Sensing

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

Murata Begins Production of 0201 Three-Terminal Low-ESL MLCCs for IC Decoupling

For component engineers, the preview brings together two important development directions: power supplies designed for high-voltage SiC switching environments and compact sensing assemblies that combine measurement, passive components and local processing. Murata will also present power, battery and passive-component solutions for AI data centers and robotics, and introduce a digital service for circuit design.

MGJ2T2 isolated supplies for SiC

Murata plans to launch the MGJ2T2 series of isolated gate-drive DC-DC converters for high-voltage silicon carbide MOSFET applications. The company positions the series around high isolation performance and strong immunity to electrical noise, targeting energy storage and distribution, motor drives and EV charging.

The engineering significance extends beyond supplying the gate-driver rail. Fast-switching power stages make the isolation barrier and its parasitic coupling important contributors to common-mode noise. As discussed in the Passive Components Blog guide to SiC and GaN gate-driver isolation, transformer geometry, interwinding capacitance and insulation requirements need to be considered together when evaluating an isolated auxiliary supply.

Murata has not yet disclosed detailed MGJ2T2 electrical specifications in the announcement. Output-voltage options, power ratings, isolation limits and quantified noise-immunity performance therefore remain points to confirm when further product information is released during the show.

SCI36LT integrates sensing and processing

The SCI36LT series is a six-degrees-of-freedom inertial measurement solution that integrates a sensor, the required passive components and a microcontroller in a single compact LGA package. Its integrated MCU can run complex sensor-fusion algorithms, including Murata’s proprietary algorithm for determining pitch, roll and yaw.

This integration makes the package architecture a central part of the announcement: Murata is combining movement measurement with the processing needed to derive orientation, rather than presenting only a standalone sensor element. The release does not yet provide numerical accuracy, package dimensions, interface specifications or processing-performance data; further details are scheduled for electronica.

Human interfaces for physical AI

Murata will demonstrate two approaches to capturing human input for AI systems.

  • Camera-free hand tracking: Developed with Melt Interface Technologies, the demonstration uses compact, high-sensitivity LF antennas at the fingertips to capture hand and finger movements. Murata identifies potential applications in robot learning, teleoperation and transferring skilled human techniques into digital training data.
  • Mask-based voice capture: A mask voice clip uses a Picoleaf piezoelectric film sensor to detect mask vibrations generated by speech. The demonstration targets clear voice input in noisy environments, including factories.

The two concepts address different input channels—motion and speech—but share the objective of connecting physical human activity to digital systems. Murata describes the hand-tracking technology as a potential source of real-world training data for physical AI, rather than announcing a finished robot-learning platform.

Automotive sensing and connectivity

The mobility demonstrations will combine sensing, positioning, communications and power technologies in live vehicle and exhibition-hall environments.

DemonstrationAnnounced technologyApplication focus
Vehicle positioningPrecise positioning developed with Hexagon, plus Murata sensor technologiesHeadlight levelling and GNSS-free positioning
In-cabin sensor fusionAutomotive-grade 60 GHz radar combined with Smart Eye’s AI-powered interior sensing and fusion softwareDriver monitoring, occupant monitoring and child presence detection
Moving-vehicle communicationsLive vehicle-to-everything demonstrationV2X connectivity
Camera-lens clearingUltrasonic Clearing Device using piezoelectric technologyMaintaining camera visibility in bad weather for ADAS and future automated-driving applications

The Ultrasonic Clearing Device is particularly relevant to sensing-system availability. Rather than changing the camera’s image-processing function, it applies ultrasonic vibrations to the lens to help maintain visibility when weather conditions interfere with sensing. Murata has not published quantified clearing performance in this announcement.

Indoor tracking and wearables

The connectivity area will demonstrate indoor tracking using BorealPath positioning technology from Nordic Inertial, incorporating a Murata inertial measurement unit. Murata’s Wi-Fi HaLow Type 2HK and Type 2HL modules will provide long-range, low-power communication of location and device information. The demonstration targets indoor and GNSS-challenged tracking applications; an ultra-wideband smart door lock and compact LoRa modules will also be shown.

Wearable and tactile demonstrations will include:

  • Wonder Stone: Murata’s echorb demonstration uses 3DHaptics technology to create sensations resembling being pushed or pulled, communicating directional information through the hand. Potential uses include navigation and guidance for visually impaired users.
  • Smart Ring: Developed with Sensoryx, the demonstration combines ultrasound distance measurement with IMU orientation and movement data for pointing, writing and 6DoF motion tracking.
  • Microblower: A cuff-based wearable demonstration will showcase inflation using Murata’s compact air-moving technology, which the company describes as quiet and low-vibration.

For background on tactile interfaces, the Passive Components Blog explanation of piezoelectric haptic technology explores how electronic devices can communicate more nuanced sensations than a simple vibration alert. It provides general context rather than a description of the specific actuator construction used in Wonder Stone.

AI infrastructure and design evaluation

Murata will also present power, battery and passive-component solutions addressing efficiency and reliability requirements in AI data centers and robotics. A dedicated IC area will cover semiconductor and integration technologies, including embedded solutions, optical communications and a reference-design demonstration. The announcement does not identify specific passive-component families or electrical ratings for these exhibits.

For engineers evaluating the preview, the important distinction is between announced product introductions and exploratory demonstrations. MGJ2T2 and SCI36LT have named series and defined application positioning, but their detailed specifications are still pending. Several other exhibits are concepts or products under development, and Murata notes that specifications and appearance may change without notice.

Visitors can use the exhibition to discuss application requirements with Murata’s specialists and clarify datasheet availability, evaluation hardware, integration requirements and development status before moving toward design-in.

Further reading

  • Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations — Deeper context on insulation, magnetics, capacitors and EMC in emerging AI infrastructure.
  • Murata Safety Ceramic Capacitor Solutions for EV Powertrains — Technical background on safety capacitors and common-mode filtering in automotive power systems.

Source

This article is based on Murata Manufacturing’s press release dated 6 October 2026, with additional engineering context from relevant Passive Components Blog technical articles. The announcement previews electronica exhibits rather than providing complete design specifications; current manufacturer documentation should be used for component selection and qualification.

References

  1. Murata press release: Murata Brings Intelligence to Life at electronica 2026 with New Technology and Immersive Demonstrations.[murata]
  2. Murata electronica 2026 exhibition overview.

Related

Recent Posts

Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

28.10.2026
10
Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

Exxelia Brings High-Temperature Passives to Electronica 2026

29.10.2026
13

IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

28.10.2026
11
Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

27.10.2026
12
Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

Bourns Releases 450 V Power TVS for DC Bus Clamping

27.10.2026
14
MLCC construction image

Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

26.10.2026
34
Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

26.10.2026
21
SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

26.10.2026
9
TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

22.10.2026
20

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved