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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

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    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

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TE Connectivity Acquires Kemtron to Expand Performance Materials Offerings

13.6.2022
Reading Time: 1 min read
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TE Connectivity (TE), a world leader in connectivity and sensors, has completed the acquisition of Kemtron Ltd. (incl. its subsidiary -Kemtron Sarl), a United Kingdom based company and leading provider of EMI/RFI shielding, environmental sealing, gaskets and components.

With TE’s depth of engineering expertise and manufacturing of heat shrink tubing, the acquisition of Kemtron Ltd. further strengthens TE’s capabilities and design solutions for customers who produce sensitive electronics subject to extreme temperatures, harsh environments and radio frequencies.

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“I am excited to welcome Kemtron Ltd. to TE,” said Nick Jones, vice president and general manager of TE’s Performance Materials business. “Combining TE’s expertise in heat shrink tubing, manufacturing scale and distribution with Kemtron Ltd.’s reputation for providing quality and market-leading EMI/RFI solutions, we can significantly enhance the value we bring to our customers. The resulting expansion of our advanced materials science and engineering capabilities marks an important milestone in our strategic vision to expand in these critical shielding and sealing markets.”

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Source: TE Connectivity, Kemtron

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