This webinar explores the reasoning behind the PCB layout recommendations for MagI³C Power Modules. MagI³C MicroModules will be used to illustrate the layout guidelines step-by-step.
The complete layout design cycle will be presented, starting with basic design rules, and continuing with the advanced application-oriented topics of EMI mitigation and thermal optimization techniques. REDEXPERT’s thermal simulation tool will be shown along with real EMI measurements performed by Würth Elektronik engineers to empirically demonstrate the impact of following these layout guidelines.