Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

    YAGEO Unveils Multilayer Piezoelectric Actuators

    Bourns CSI2F bolt-down current sense resistors for high-current busbar measurement

    Bourns Current Sense Resistors Reach 36 W

    Wk 38 Electronics Supply Chain Digest

    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

    YAGEO Unveils Multilayer Piezoelectric Actuators

    Bourns CSI2F bolt-down current sense resistors for high-current busbar measurement

    Bourns Current Sense Resistors Reach 36 W

    Wk 38 Electronics Supply Chain Digest

    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Yageo and Foxconn to Form a Semiconductor Joint Venture, XSemi

6.5.2021
Reading Time: 3 mins read
A A

Yageo Group and Hon Hai Technology Group (Foxconn Technology Group) today announced to enter into a joint venture agreement to form XSemi Corporation (“XSemi”). The goal of this newly established joint venture is to extend the businesses into the semiconductor industry, including product development and sales.

In the future, XSemi will be based in Hsinchu, Taiwan and consolidate the strengths and resources of the two market leaders, in addition to the upcoming multifaceted collaborations with leading semiconductor companies in product design, process and capacity planning, and sales channel. XSemi will create a complete semiconductor supply chain and provide customers total solution services with high-quality products and stable supplies.

RelatedPosts

YAGEO Unveils Multilayer Piezoelectric Actuators

Bourns Current Sense Resistors Reach 36 W

Wk 38 Electronics Supply Chain Digest

Yageo and Hon Hai has developed and fine-tuned a superb strategy and operating model through their long-term cooperation. The partnership has created synergies through innovation and integration of services and resources, producing operation efficiencies and concreting growth for both conglomerates in a fast paced environment. The new joint venture XSemi will deepen their footprint in semiconductor, focusing on the development of semiconductor chips with average selling prices lower than US$2.00, in which they call it “Small IC”. So far, the two have started discussions with several global semiconductor companies, and will in the near future announce the collaboration plans in the semiconductor industry.

Young Liu, Chairman of Hon Hai, expresses his belief that “the semiconductor industry is facing the biggest upheaval in the past three decades, and the industry order will face a serious restructuring. Now is undoubtedly the best timing to initiate strategic partnerships in various segments.” Hon Hai has started its semiconductor strategy according to its mid-to-long term blueprints, making it one of the three core technologies for the conglomerate. Within its reach in the semiconductor supply chain, Hon Hai has built capabilities within semiconductor equipment, design services, IC design in 5G, AI, CIS (CMOS Image Sensors), and display driver, foundry fabs, and advanced packaging. This comprehensive portfolio will ride along Hon Hai’s long-term plan in the three major emerging industries in EV, digital health, and robotics, to enhance and vertically consolidate the industry supply chain.

XSemi‘s key product focus, small ICs, will become the most important element of Hon Hai’s future plan. It will not only create a steady semiconductor supply to the company’s current communication applications and future emerging technologies, but also fulfill the needs of its international customers, and ultimately enhance the company’s overall profitability.

Yageo’s strengths lie in efficient component production and process management, and it is known for comprehensive global sales channels. This new collaboration with Hon Hai could be seen as a natural extension and progression of the strategic alliance initiative with Hon Hai last year. This will not only fortify Hon Hai’s need for the key core components for EV and digital health, but also showcase Yageo’s forte in consolidation of resources.

After the acquisition of KEMET and Pulse, Yageo has put an emphasis on high-end product development to consolidate technologies and channels to be close to its customers. Yageo has extensive experiences in the key components of the creation of EV, including powertrain, battery management system, ADAS, on top of other high-end applications like digital health, industrial, and 5G technologies.

Pierre Chen, Chairman of Yageo, believes that “Yageo aims to create a one-stop shop for its customers, and through this joint venture, we will further provide the services and products that meet customers’ need for supply chain optimization.” With the creation of XSemi, Yageo will further expand its footprints in passive components into semiconductors, offering an even more complete component portfolio, opening more room for growth in the future.

Pierre Chen, Chairman of Yageo Group and Young Liu, Chairman of Hon Hai Technology Group attended the signing ceremony and announced the partnership in person. The market for power semiconductors will reach US$40 billion by 2025, and analog semiconductors to US$25 billion. In an electric vehicle, the quantity share of small IC will be over 90% among all semiconductor components. The presence of the two chairmen signifies the importance of this joint venture to the development of both companies. With the combination of the complementary strengths, Yageo and Hon Hai look forward to creating a powerful semiconductor company in the industry.

Related

Source: Yageo

Recent Posts

DigiKey Factory Tomorrow Season 6 graphic illustrating AI-ready industrial connectivity, data infrastructure and smart manufacturing networks.

DigiKey Factory Tomorrow Season 6 Explores AI-Ready Factories

1.10.2026
5
Sep 2026 electronics market heat map

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

30.9.2026
59
TDK and TAIYO YUDEN business alliance announcement for advanced MLCCs and inductors supporting AI infrastructure.

TDK and TAIYO YUDEN Explore Alliance for MLCCs and Inductors

29.9.2026
127
Metallized film capacitor winding with PEN, PET and polypropylene dielectric film layers shown in a power-electronics supply-chain concept

PEN Film Supply Challenges and Capacitor Replacement Paths

29.9.2026
23
Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

Rheinmetall Funds NanoLam Capacitor Production Scale-Up

22.9.2026
75

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
108
ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

10.9.2026
69

Emerging Capacitor Markets in Fusion Energy

10.9.2026
87
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
183

Upcoming Events

Oct 9
18:00 - 19:00 CEST

Edgewater Research 3Q26 Electronic Components Review Outlook Webinar

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved