Vishay has introduced a thin film submount platform aimed at high speed optical transceivers, RF modules, and advanced electronic packaging...
Read moreDetailsExxelia’s CM‑HVLP series introduces a new generation of SMD high‑voltage reconstituted mica capacitors for designers who need both pulse handling...
Read moreDetailsEdgewater Research’s IP&E report suggests that the momentum for recovery is continuing to build and strengthen. However, the roadmaps for...
Read moreDetailsKyocera AVX has introduced the FFLK series traction‑grade DC-link filtering film capacitors for high‑power drives and traction inverters in electric...
Read moreDetailsYAGEO Group has introduced the R41D V234 Series, a new high-current Y2/X1 metallized polypropylene film capacitor family aimed at EMI...
Read moreDetailsAmphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Read moreDetailsHirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Read moreDetailsSamsung Electro-Mechanics has introduced a new range of ultra-high-voltage MLCCs in 1210 (3.2 × 2.5 mm) size for xEV high-voltage...
Read moreDetailsTDK has introduced the B82722V6*B040 series of high‑voltage, current‑compensated ring‑core double chokes for DC bus voltages up to 1250 V...
Read moreDetailsVishay’s new IHLP1212‑EZ‑1Z power inductors bring the well‑known IHLP low‑profile, high‑current technology into a very compact 1212 case size (3.0...
Read moreDetails
© EPCI - Leading Passive Components Educational and Information Site
© EPCI - Leading Passive Components Educational and Information Site