Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering

28.7.2026
Reading Time: 8 mins read
A A

TDK’s new EP21 series SMD common‑mode chokes targets high‑current low‑voltage EMI filtering where PCB area and thermal performance are critical.

The flat‑wire double choke construction, underbody termination and four‑pin SMD design make these parts attractive for modern DC‑DC converters and compact EMC protection circuits according to the manufacturer press release.

RelatedPosts

TDK X Series SMD Varistors for Industrial Transient Protection

TDK Expands1608 Inductors for Automotive PoC Filters

TDK Expanded DC-Link Film Capacitors to Reach +135 °C

Key features and benefits

  • High current handling up to 35 A at low DC resistance, supporting high‑power DC‑DC stages without excessive conduction loss.
  • Low DC resistance down to 0.44 mΩ, helping reduce copper loss and ease thermal design in dense layouts.
  • Wide inductance range from 160 µH to 640 µH, allowing engineers to trade off impedance profile and current rating for different converter topologies.
  • Flat‑wire winding on MnZn ferrite core, improving fill factor and thermal paths compared to classic round‑wire coils, with MnZn ferrite optimized for common‑mode suppression in the 100 kHz–MHz range.
  • SMD format with underbody termination, reducing footprint to 23.8 x 17.7 mm and simplifying automated assembly versus through‑hole chokes.
  • Four‑pin design for mechanical robustness, providing stable solder joints and good coplanarity on the PCB, important for high‑mass magnetics in reflow processes.
  • Impedance peak in the 500 kHz–3 MHz region, matching typical switching frequency bands and harmonics of modern DC‑DC converters and low‑voltage power electronics.

Typical applications

The EP21 common mode choke series is aimed at common‑mode noise suppression in low‑voltage high‑current systems. Typical use cases include:

  • Common‑mode input or output filters in non‑isolated DC‑DC converters (step‑down/step‑up regulators).
  • EMC protection in low‑voltage power distribution rails in industrial and telecom equipment.
  • Common‑mode filtering on battery and DC bus connections in e‑mobility or robotics, where currents above 20 A are common.
  • Noise suppression on auxiliary low‑voltage supplies in larger power systems with fast power stages.
  • Compact common‑mode filtering in rack‑mount or module‑based PSU designs that need SMD assembly for high throughput.

In practice, these chokes sit in series with both lines of a differential pair (for example, +V and return) and primarily attenuate common‑mode components while keeping differential‑mode impedance relatively low.

Technical highlights

Electrical ratings

  • Rated voltage: 48 V AC and 80 V DC, suitable for typical low‑voltage DC buses (48 V telecom, 48 V industrial systems, higher‑current 24 V rails with transient margins).
  • Rated current: 20.3 A to 35.0 A across the series, without derating up to +70 °C according to the manufacturer datasheet.
  • Temperature behavior: No derating required up to +70 °C; above this point derating must be applied, which is important when placing the component near hot power devices.
  • DC resistance (typical): 0.44 mΩ to 1.75 mΩ across types, directly influencing I²R loss and temperature rise.
  • Rated inductance: 160 µH to 640 µH per common‑mode winding, with average stray inductance down to 200 nH.
  • Stray inductance (average): 200 nH to 900 nH, indicating relatively low differential‑mode inductance so the choke primarily acts on common‑mode noise.
  • Impedance peak frequency: Maximum impedance occurs between 500 kHz and 3 MHz depending on type, aligning with typical switching frequencies and their harmonics.

Mechanical and construction data

  • Package format: SMD double choke with four pins.
  • Footprint: 23.8 x 17.7 mm for all variants.
  • Height: Between 21.6 mm and 22.3 mm, enabling relatively compact vertical integration compared with classic bobbin chokes.
  • Underbody termination: Terminals located under the component body, minimizing lateral pad area and allowing dense placement.
  • Core material: MnZn ferrite, a standard choice for power/common‑mode inductors balancing permeability and loss at targeted frequency ranges.
  • Winding technology: Flat‑wire, improving current density, lowering AC resistance and supporting better thermal paths than equivalent round‑wire designs.

EP21 series overview table

Ordering codeRated current [A]Inductance [µH]DC resistance [mΩ]Stray inductance (AVG) [nH]Dimensions L x W x H [mm]
B82552J2164J02135.01600.4420023.8 x 17.7 x 22.3
B82552J2284J02130.82800.8039023.8 x 17.7 x 21.9
B82552J2444J02123.54401.2550023.8 x 17.7 x 21.7
B82552J2644J02120.36401.7590023.8 x 17.7 x 21.6

This table illustrates the trade‑off between current rating, inductance and DC resistance: higher inductance variants provide more common‑mode impedance at lower frequencies at the expense of higher DC resistance and lower rated current.

Variant selection table (design perspective)

Design priorityRecommended variantsComment
Maximum current, minimal lossB82552J2164J021Best suited for highest load currents and hot spots
Balanced current vs inductanceB82552J2284J021, B82552J2444J021Good middle ground for typical DC‑DC converter rails
Highest common‑mode impedanceB82552J2644J021For strongest suppression where current margin is available

This table is a qualitative indication based on the electrical data; final choice should be confirmed against the specific EMC and thermal requirements of the target design.

Design‑in notes for engineers

  • Define noise profile first: Measure or simulate common‑mode noise spectra of the DC‑DC converter or power rail. Choose the EP21 variant whose impedance peak aligns with the dominant noise frequencies, keeping in mind that these parts peak between 500 kHz and 3 MHz.
  • Check current and temperature margins: Use the rated current and DC resistance values to estimate conduction losses P=I2⋅RP = I^2 \cdot RP=I2⋅R and temperature rise at full load. Ensure operation within the no‑derating region up to +70 °C or apply appropriate derating curves from the manufacturer datasheet for higher ambient temperatures.
  • Place carefully in the layout: Given the height and mass of the EP21 components, ensure solid pad design, sufficient solder fillet and mechanical support, especially in applications subject to vibration or shock.
  • Consider stray inductance impact: While stray inductance is relatively low, it can still introduce differential‑mode impedance at high frequencies. In fast‑edge digital or very low‑voltage rails, verify that voltage drops and ringing remain acceptable.
  • Combine with differential‑mode elements where needed: Common‑mode chokes often work together with X/Y capacitors or dedicated differential‑mode inductors. The EP21 series provides the common‑mode element; overall EMC performance depends on the complete filter design.
  • Account for underbody termination during PCB design: Ensure correct land pattern as specified in the datasheet so that the underbody contacts wet properly and solder inspection is feasible. Pay attention to solder mask definition and stencil thickness.
  • Verify creepage and clearance: While these components are intended for low‑voltage applications, it is still essential to check creepage/clearance distances and insulation specifications according to the applicable standards for the end equipment.
  • Use manufacturer tools and data: TDK’s design tools and product catalog entries can help refine the choice of part number, especially when optimizing for EMC compliance in complex systems.

Source

This article is based on the official TDK Electronics press release and associated product information for the EP21 series SMD common‑mode chokes, with additional independent editorial context for design engineers and purchasers.

References

  1. TDK presents SMD common‑mode chokes for up to 80 V/35 A with a minimized PCB footprint
  2. TDK Electronics – Data and signal line chokes / common‑mode filters product catalog
  3. EP21 / B82552JJ021 series press image download
  4. EP21 / B82552JJ021 series press release PDF

Related

Recent Posts

Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

19.10.2026
8
TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

TDK X Series SMD Varistors for Industrial Transient Protection

14.10.2026
12
Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
13
Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

TT Electronics: Resistor and Sensing Trends at electronica 2026

9.10.2026
15
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
41
Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

TDK Expands1608 Inductors for Automotive PoC Filters

6.10.2026
12
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
71
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
51
YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

YAGEO Unveils Multilayer Piezoelectric Actuators

5.10.2026
28

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved