Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

    Vishay Releases Harsh Environment Robust DC-Link Film Capacitor

    Bourns Releases Automotive High Creepage and Clearance Transformer

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

    Samtec Releases 800-Position High-Performance Array Connectors  

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

    Vishay Releases Harsh Environment Robust DC-Link Film Capacitor

    Bourns Releases Automotive High Creepage and Clearance Transformer

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

    Samtec Releases 800-Position High-Performance Array Connectors  

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Kyocera Doubling its Investment into Electronic Components over the Three Years

29.12.2022
Reading Time: 2 mins read
A A

Kyocera is more than doubling its capex and R&D budget to $9.78 billion over the three years March 2022-26, Kyocera’s President Hideo Tanimoto told the Nikkei Asia.

Kyocera will expand its investment in semiconductor-related production and other businesses, increasing total capital spending and research and development to 1.3 trillion yen ($9.78 billion) over the three fiscal years through March 2026, roughly doubling its previous three-year plan.

RelatedPosts

KYOCERA Releases SAW Devices with Significantly Lower Loss

KYOCERA Releases Industry Smallest SAW Quadplexer

KYOCERA Developed Industry Leading 008004 Hi-Q MLCC for PA Modules

The Japanese electronics group will raise part of the funds by pledging its KDDI shares as collateral for the first time while borrowing up to 1 trillion yen. Kyocera President Hideo Tanimoto recently revealed the plans to Nikkei.

Having maintained a debt-free management policy, Kyocera will make aggressive investments in areas including ceramic components as it expects the chip market to expand over the medium term. The company plans up to 900 billion yen in capital expenditures, about double the amount over the past three years, and aims to spend 400 billion yen on R&D, a 60% increase.

In Kagoshima prefecture in southern Japan, Kyocera is investing about 60 billion yen to construct a new semiconductor package production facility. In Nagasaki, the company is constructing its first new domestic plant in about 20 years, since the start of operations at its Ayabe factory in Kyoto. Tanimoto said the company plans to “invest up to 100 billion yen to produce ceramic components and semiconductor packaging,” with the new plant set to begin operating in 2026.

The area is located near other chip plants such as that of Sony Group and is near an expressway interchange and other transportation infrastructure. In Vietnam, meanwhile, Kyocera is expanding factories producing multifunctional machines and quartz components.

Related

Source: Nikkei Asia

Recent Posts

Connector Industry Achieves Double-Digit Growth

19.8.2025
21

July 2025 ECST Components Survey Continue with Strong Sales Sentiment

4.8.2025
80

PCNS 2025 Final Program Announced!

4.8.2025
104

DigiKey Expands Inventory with Over 32,000 Stocking NPIs in Q2 2025

31.7.2025
16

European Components Distribution (DMASS) Faces Continued Decline in Q2 2025

30.7.2025
84

The Connector Industry is Undergoing Transformation

25.7.2025
90

Würth Elektronik Opens Branch in South Africa

24.7.2025
31

July 2025 Interconnect, Passives and Electromechanical Components Market Insights

23.7.2025
144

Samsung Electro-Mechanics Focuses MLCCs on AI servers and Automotive

22.7.2025
97

June 2025 ECST Components Survey Delivers Stunning Results

21.7.2025
42

Upcoming Events

Sep 3
15:30 - 17:30 CEST

How to Choose Your Magnetic Supplier

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version