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    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

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    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

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    Calculating Resistance Value of a Flyback RC Snubber 

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    Thermistor Linearization Challenges

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KYOCERA Releases Industry Smallest SAW Quadplexer

23.2.2024
Reading Time: 2 mins read
A A

Kyocera’s new unique SAW technology provides high performance, high-power resistance, and the industry’s smallest 2.0×1.6mm size (versus conventional 2.5×2.0 mm size).

The SQ20 Series was developed for use in smartphones and communication devices. Kyocera’s unique SAW technology provides high performance and high-power resistance. 

RelatedPosts

KYOCERA Releases SAW Devices with Significantly Lower Loss

KYOCERA Developed Industry Leading 008004 Hi-Q MLCC for PA Modules

KYOCERA Develops 0201 MLCC Capacitor with Industry’s Highest Capacitance of 10uF

Featuring the industry’s smallest size* of 2.0×1.6 mm, demand is expected for the most advanced 5G communications equipment that supports carrier aggregation (CA).

Kyocera will continue to contribute to the realization of high-quality wireless communications using unique SAW technology.

What is carrier aggregation?
It is a wireless communication technology that improves communication speed and achieves stable high-speed communication by using multiple frequency bands simultaneously.

Features

  • Industry’s smallest size.
    Successfully miniaturized to 2.0×1.6 mm while maintaining high quality and reliability.
  • Higher performance compared to conventional product’s size (2.5×2.0mm).
    In addition to being smaller and lighter, this product also achieves lower loss, higher damping characteristics, higher isolation, and higher power resistance.
  • Kyocera’s unique SAW technology
    The SQ20 series is compatible with n25, n66, and n70, which are more difficult to develop compared to other frequencies.

Applications

  • Smartphones
  • Communication devices, etc

Related

Source: KYOCERA

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