The paper Layer-By-Layer Printed Dielectrics For Next-Generation Film Capacitors For Energy Efficient Space Systems was presented by William Greenbank, University ...

This paper Stress Testing of Chip Aluminum Polymer Capacitors was authored by Alexander Teverovsky Jacobs Technology Inc., NASA/GSFC and presented by Jay ...

This paper on 70GHz high frequency behavior of chip thin film resistors following AEC-Q200 qualification tests was presented by Benjamin ...

This paper 3D printing of passive electronic components from the perspective of a components manufacturer was presented by Johann Pichler, ...

This paper on new fast lock RF interface was presented by Olivier Berenfeld, Radiall SA, France during the 5th Space ...

This paper on novel high energy graphene material for supercapacitors was presented by Tomas Zednicek, EPCI European Passive Components Institute during ...

This article discusses corrosion in electronic systems, contacts and housing, including its development and prevention. The post is based on Würth ...

This article provides an overview of EMC requirements and the associated issues for the housing and the system. The post ...

Hirose introduces FH81 series with one action and top & bottom contact connectors that improve design flexibility and workability in ...

Stackpole Electronics announces the addition of a 0.2 milliohm value to its 3-watt rated CSNL2512 current sense resistor. This new ...