Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs
Bourns has released four new multilayer chip inductor series – CE0603G, CE0603M, CE1005Q and CE1608Q – aimed at compact RF ...
Bourns has released four new multilayer chip inductor series – CE0603G, CE0603M, CE1005Q and CE1608Q – aimed at compact RF ...
A Penn State–led team has developed a new polymer “alloy” capacitor film that stores up to four times more energy ...
ECIA’s January 2026 survey signals the strongest sales sentiment for the electronic components industry in more than four and a ...
Vishay’s new CRCW0201-AT e3 series extends the company’s thick film chip resistor portfolio into the ultra-compact 0201 size with full ...
Würth Elektronik is providing live, manufacturer‑verified data for more than 22,000 electronic and electromechanical components to the Accuris Parts Intelligence ...
Coilcraft’s CMA family is a series of automotive‑qualified surface‑mount common mode chokes designed for EMI suppression in high‑current power line ...
AI server demand is rapidly absorbing high‑end MLCC capacity and manufacturers are considering price increase of the high end MLCC ...
YAGEO Group has introduced three new antennas that target high‑reliability wireless connectivity and precision positioning: a compact 2×2 MiMo Wi‑Fi ...
SCHURTER’s USE 2410 is a quick-acting, wire-in-air surface‑mount fuse in the compact 2410 footprint, designed for both AC and DC ...
TDK has extended its NTCSP chip thermistor family with new automotive‑grade parts qualified up to 175 °C for conductive‑glue mounting ...
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© EPCI - Leading Passive Components Educational and Information Site