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    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

    Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

    Panasonic EVP-BX Quiet Tactile Switches for HMI Designs

    Motor Run Capacitor Safety Classes S0–S3: A Design Guide

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    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

    Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

    Panasonic EVP-BX Quiet Tactile Switches for HMI Designs

    Motor Run Capacitor Safety Classes S0–S3: A Design Guide

    YAGEO Piezoelectric Sensors for Predictive Maintenance

    Trending Tags

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    • RF
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    • Tantalum vs Ceramic
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Surface-mount fuses rate to 100 A in a single device

3.1.2018
Reading Time: 1 min read
A A

source: Electronic products news

Ultra-high current rating Littelfuse SMD fuse eliminates need to use parallel fuses or large devices.

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Circuit boards with high current demands, like blade servers, backplanes, and high-wattage power supplies, create challenges for developers incorporating circuit-protecting fuses. To use compact, surface-mount devices required the paralleling of multiple lower-current fuses or the use of larger, overcapacity industrial devices. The Nano2 881 series of fuses corrects the situation, offering ratings to 100 A in a 12.5 x 10 x 6.8-mm surface-mount device (SMD).

The 881 series devices are RoHS-compliant with robust operating characteristics. They have thermoplastic bodies that work in –55°C to 100°C operating environments, have cold resistance as low as 0.45 Ω, and exhibit a nominal voltage drop of under 85 mV. Their robust physical design also reduces their susceptibility to temperature cycling and vibration, enhancing system reliability.

The devices also have impressive electrical characteristics. With a 75-V operating voltage, they have a range of current ratings of 60 to 100 A. At 200% overload current, they interrupt within 60 s. With surge currents, they can protect against as much as 1,500 A without rupturing (interrupting rating).

Circuit boards handling high current while requiring high component density are candidates for use of the 881 series. Typical applications in the data center market include blade servers, server chassis, backplane boards, and line cards. Additional applications in the power system market include uninterruptible power supplies, base station power supplies, high-power battery systems, and power factor correction (PFC) in high-wattage power supplies.

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