ABC of PCB Interconnect Archives

This presentation by René Linde, Field Application Engineer at Würth Elektronik published by All About Circuits discusses PCB design challenges ...

Multi-Connectors Mating

20.3.2025

55

This article is based on a blog post by Samtec that explores the concept of tolerance stack-up and the mating ...

IPC Class 2 vs Class 3 Solder Joints Requirements Explained

27.2.2025

600

In this post, inspired by the Samtec blog, we’ll briefly examine IPC-A-610 Class 2 and Class 3 J-lead and Gull ...

How to Determine Chip Temperature

3.1.2025

251

This article written by Dr.-Ing. Martin Schulz, Global Principal, Application Engineering, Littelfuse, provides insight into how to determine packaging chip ...

Die and Wire PCB Bonding Explained

1.7.2025

167

This webinar from Würth Elektronik explains principles of die and wire bonding on printed circuit boards including the complete manufacturing ...

EMI Shielding Challenges

1.7.2025

16

Explore modern EMI shielding techniques and learn how to prevent electromagnetic interferences (EMI) from impacting sensitive electronics in this Würth ...

EMC with Electromechanical Inter-Connections

1.7.2025

19

This Würth Elektronik webinar focuses on the basics of electromagnetic compatibility (EMC) related to the use and applications of electromechanical ...

Designing and Testing HDI PCBs for Harsh Environments

1.7.2025

11

In this Würth Elektronik webinar we will offer you insights into HDI PCBs for Harsh Environments: the failure mechanisms of ...

RF PCB Connector Impedance Matching and Dynamics

1.7.2025

82

This Würth Elektronik presentation is about sharing impedance variations and comparative analyses of transmission line structures and connector configurations. In ...