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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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VPG Foil Resistor’s First-of-its-kind Newest High-Precision Resistor Offers Unique Capabilities for Telecom Applications

7.9.2021
Reading Time: 2 mins read
A A

VPG Foil Resistors are introducing innovative packaging design of high precision resistors to avoids known flip-chip mounting challenges and pairs with highest resistor performances available in a 0402 package size.

VPG Foil Resistors, released the FRFS0402, its smallest ultra-high-precision Bulk Metal® Foil technology resistor which features a standoff construction that offers an improvement over regular flip chip technology.

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The FRFS0402 is ideally suited for use in telecommunication network equipment (including 5G, downhole data center, or fiber optics), medical equipment (including pace makers or hearing-aids), high temperature applications, automated test equipment (ATE), mid-range audio, handheld meters and other small size instrumentation or control equipment.

It also can be used in avionics, military, and space (AMS) applications. VPG Foil Resistors’ invention of a unique flip chip construction with standoffs offers a breakthrough for mounting reliability and assembly efficiency since it allows for regular visual inspection and adds more robustness to the soldering points.

In addition, the thicker terminals increase the component’s power rating due to improved heat dissipation, and provide 40% PCB space savings compared to traditional wraparound components. With more than 2 years of production use, VPG Foil Resistors flip chip design has not experienced any known cases of solder cracks or other mounting issues.

Originally custom designed to meet the requirements of a fiber optics network equipment manufacturer, VPG Foil Resistors is now offering the FRFS0402 flip chip package with standoffs for standard purchase. Utilizing a Z1 Foil Technology resistive element, the FRFS0402 builds on the latest evolution of the Bulk Metal® Foil technology, making it the best performing 0402 size resistor available in the market.

The FRFS0402 features a maximum TCR of ±2.5ppm/°C (–55°C to +125°C, +25°C Ref) and a very high typical long-term stability of 0.01% (100ppm) at +70°C, 2,000 h (at rated power). The Bulk Metal® Foil technology furthermore provides other inherit advantages over alternative resistors including a tolerance to ±0.05% (500 ppm), a non-inductive, non-capacitive, non-hot-spot design, and a short time overload capability of ≤0.01% (100 ppm).

The FRFS0402’ rated power of 75 mW at +70°C and gold finished terminals allow for reliable operation at high ambient temperatures up to +200°C. This high power rating for a 0402 resistor, achieved by the unique standoff construction, paired with the fast stabilization under power due to the Z1 Foil Technology, makes the FRFS0402 ideal for demanding applications such as 5G fiber optic data transmission networks or high temperature sensors.VPG Foil Resistors is currently offering its FRFS0402 resistors with resistance value between 170 Ω up to 1 kΩ, up to five digits. Further expansion of that range is under evaluation. 

Related

Source: VPG Foil Resistors

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