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    Bourns Automotive BMS Signal Transformer Combines Reinforced Isolation and Common-Mode Noise Rejection

    Murata Launches 100V 10 µF Lead-Type MLCCs for 48V Systems

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    Wk 32 Electronics Supply Chain Digest

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    Bourns Automotive BMS Signal Transformer Combines Reinforced Isolation and Common-Mode Noise Rejection

    Murata Launches 100V 10 µF Lead-Type MLCCs for 48V Systems

    Bourns Extends Current Sense Resistors for High-Current Power Designs with 0.1 mΩ, 15 W

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    Vishay Introduces Automotive Low Loss SMD Common-Mode Chokes

    YAGEO Adds X8 Flexible-Termination Automotive MLCCs for 150°C Designs

    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

    Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

    Wk 32 Electronics Supply Chain Digest

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    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

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    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

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Wk 39 Electronics Supply Chain Digest

30.9.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 9-27-24.

DATAPOINT OF THE WEEK: S&P reported that manufacturing activity deteriorated in September across the US and the European Union.

RelatedPosts

Wk 32 Electronics Supply Chain Digest

Wk 31 Electronics Supply Chain Digest

Wk 30 Electronics Supply Chain Digest

Flash readings showed the Eurozone manufacturing PMI declined to a 9-month low of 44.8, compared to 45.8 in August, driven by a faster decline in output and new orders, particularly in Germany and France.

In the US, S&P reported a September flash manufacturing PMI of 47.0, down from 47.9 in August, marking the lowest level in 15 months, which is primarily driven by a weakening in new orders to a level not seen in 21 months.

Headlines:

Auto

  • China auto association submits ‘urgent report’ to Chinese authorities as price wars leave dealers in peril
  • Europe Auto industry capacity utilization down to 60% according to Reuters
  • Europe auto industry faces perfect storm, ACEA says
  • New US rule would require GM, Ford to halt imports of cars they build in China
  • China’s Leapmotor and Stellantis open orders in Europe for budget EVs
  • Stellantis unions in Italy to strike over falling output
  • Swedish EV battery maker Northvolt to cut 20% of staff amid liquidity crunch
  • US administration proposes banning Chinese vehicles from US roads with software crackdown
  • VW Group trims jobs in China to lower costs, counter sales slump
  • VW workers threaten strikes to fight plant closures, job losses in Germany
  • Toyota global output falls for 7th straight month in August

Datacenter

  • Alphabet to invest $3.3B for two data centers in South Carolina
  • US Justice Department probes Super Micro Computer, WSJ reports

Industrial

  • Siemens to carve out eMobility EV charging unit

Semiconductors

  • Qualcomm explores acquiring pieces of Intel chip-design business
  • Apollo Asset Management to offer multibillion dollar investment in Intel
  • Intel launches Xeon 6 and Gaudi 3 AI chips to boost AI and HPC performance
  • Intel and US race to finalize $8.5bn in chips funding by year’s end
  • Intel has rebuffed Arm inquiring about buying Intel’s product unit
  • TSMC, Samsung consider building chip factories in UAE, WSJ reports
  • US finalizes $123 million chips award for Polar Semiconductor
  • Vishay announces restructuring including SG&A headcount reductions and closure of 3 manufacturing facilities by the end of 2026
  • ST unveils fourth-generation silicon carbide power technology for next-gen EV traction inverters
  • ST expands SiC collaboration in China with Sanan Optoelectronics and direct with Li Auto and Geely
  • Thailand to build first SiC facility, with operation expected by 2027
  • Kioxia reportedly cancels October IPO plans — blames unfavorable market trends
  • SK Hynix begins volume production of next-gen 12-Layer HBM3E for AI applications
  • Global 300mm fab equipment spending to each record $400B from 2025 to 2027

Related

Source: Edgewater Research

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