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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

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Wk 39 Electronics Supply Chain Digest

30.9.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 9-27-24.

DATAPOINT OF THE WEEK: S&P reported that manufacturing activity deteriorated in September across the US and the European Union.

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Flash readings showed the Eurozone manufacturing PMI declined to a 9-month low of 44.8, compared to 45.8 in August, driven by a faster decline in output and new orders, particularly in Germany and France.

In the US, S&P reported a September flash manufacturing PMI of 47.0, down from 47.9 in August, marking the lowest level in 15 months, which is primarily driven by a weakening in new orders to a level not seen in 21 months.

Headlines:

Auto

  • China auto association submits ‘urgent report’ to Chinese authorities as price wars leave dealers in peril
  • Europe Auto industry capacity utilization down to 60% according to Reuters
  • Europe auto industry faces perfect storm, ACEA says
  • New US rule would require GM, Ford to halt imports of cars they build in China
  • China’s Leapmotor and Stellantis open orders in Europe for budget EVs
  • Stellantis unions in Italy to strike over falling output
  • Swedish EV battery maker Northvolt to cut 20% of staff amid liquidity crunch
  • US administration proposes banning Chinese vehicles from US roads with software crackdown
  • VW Group trims jobs in China to lower costs, counter sales slump
  • VW workers threaten strikes to fight plant closures, job losses in Germany
  • Toyota global output falls for 7th straight month in August

Datacenter

  • Alphabet to invest $3.3B for two data centers in South Carolina
  • US Justice Department probes Super Micro Computer, WSJ reports

Industrial

  • Siemens to carve out eMobility EV charging unit

Semiconductors

  • Qualcomm explores acquiring pieces of Intel chip-design business
  • Apollo Asset Management to offer multibillion dollar investment in Intel
  • Intel launches Xeon 6 and Gaudi 3 AI chips to boost AI and HPC performance
  • Intel and US race to finalize $8.5bn in chips funding by year’s end
  • Intel has rebuffed Arm inquiring about buying Intel’s product unit
  • TSMC, Samsung consider building chip factories in UAE, WSJ reports
  • US finalizes $123 million chips award for Polar Semiconductor
  • Vishay announces restructuring including SG&A headcount reductions and closure of 3 manufacturing facilities by the end of 2026
  • ST unveils fourth-generation silicon carbide power technology for next-gen EV traction inverters
  • ST expands SiC collaboration in China with Sanan Optoelectronics and direct with Li Auto and Geely
  • Thailand to build first SiC facility, with operation expected by 2027
  • Kioxia reportedly cancels October IPO plans — blames unfavorable market trends
  • SK Hynix begins volume production of next-gen 12-Layer HBM3E for AI applications
  • Global 300mm fab equipment spending to each record $400B from 2025 to 2027

Related

Source: Edgewater Research

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