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    TDK Releases Ultra-small PFC Capacitors

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    source: Samtec

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    TDK Releases Ultra-small PFC Capacitors

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    TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

    DigiKey Presents Factory Tomorrow Season 5 Video Series

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

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    Ripple Steering in Coupled Inductors: SEPIC Case

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    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

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Wk 39 Electronics Supply Chain Digest

30.9.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 9-27-24.

DATAPOINT OF THE WEEK: S&P reported that manufacturing activity deteriorated in September across the US and the European Union.

RelatedPosts

July 2025 Interconnect, Passives and Electromechanical Components Market Insights

Wk 29 Electronics Supply Chain Digest

June 2025 ECST Components Survey Delivers Stunning Results

Flash readings showed the Eurozone manufacturing PMI declined to a 9-month low of 44.8, compared to 45.8 in August, driven by a faster decline in output and new orders, particularly in Germany and France.

In the US, S&P reported a September flash manufacturing PMI of 47.0, down from 47.9 in August, marking the lowest level in 15 months, which is primarily driven by a weakening in new orders to a level not seen in 21 months.

Headlines:

Auto

  • China auto association submits ‘urgent report’ to Chinese authorities as price wars leave dealers in peril
  • Europe Auto industry capacity utilization down to 60% according to Reuters
  • Europe auto industry faces perfect storm, ACEA says
  • New US rule would require GM, Ford to halt imports of cars they build in China
  • China’s Leapmotor and Stellantis open orders in Europe for budget EVs
  • Stellantis unions in Italy to strike over falling output
  • Swedish EV battery maker Northvolt to cut 20% of staff amid liquidity crunch
  • US administration proposes banning Chinese vehicles from US roads with software crackdown
  • VW Group trims jobs in China to lower costs, counter sales slump
  • VW workers threaten strikes to fight plant closures, job losses in Germany
  • Toyota global output falls for 7th straight month in August

Datacenter

  • Alphabet to invest $3.3B for two data centers in South Carolina
  • US Justice Department probes Super Micro Computer, WSJ reports

Industrial

  • Siemens to carve out eMobility EV charging unit

Semiconductors

  • Qualcomm explores acquiring pieces of Intel chip-design business
  • Apollo Asset Management to offer multibillion dollar investment in Intel
  • Intel launches Xeon 6 and Gaudi 3 AI chips to boost AI and HPC performance
  • Intel and US race to finalize $8.5bn in chips funding by year’s end
  • Intel has rebuffed Arm inquiring about buying Intel’s product unit
  • TSMC, Samsung consider building chip factories in UAE, WSJ reports
  • US finalizes $123 million chips award for Polar Semiconductor
  • Vishay announces restructuring including SG&A headcount reductions and closure of 3 manufacturing facilities by the end of 2026
  • ST unveils fourth-generation silicon carbide power technology for next-gen EV traction inverters
  • ST expands SiC collaboration in China with Sanan Optoelectronics and direct with Li Auto and Geely
  • Thailand to build first SiC facility, with operation expected by 2027
  • Kioxia reportedly cancels October IPO plans — blames unfavorable market trends
  • SK Hynix begins volume production of next-gen 12-Layer HBM3E for AI applications
  • Global 300mm fab equipment spending to each record $400B from 2025 to 2027

Related

Source: Edgewater Research

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