Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 44 Electronics Supply Chain Digest

4.11.2024
Reading Time: 5 mins read
A A

Electronics Supply Chain Weekly Digest 11-1-24.

DATAPOINT OF THE WEEK: ISM reported US Oct mfg PMI of 46.5 vs 47.6 reflecting accelerating decline in output and a continued decline in new orders and employment.

RelatedPosts

Wk 39 Electronics Supply Chain Digest

Wk 38 Electronics Supply Chain Digest

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

S&P reported US Oct mfg PMI of 48.5 vs 47.3 in Sep reflecting a continued decline in new orders and output, albeit at a slower pace vs Sep. China government reported October mfg activity expanded for the first time in 6 months with PMI of 50.1 vs 49.8 in Sep driven by large enterprises.

S&P Globa/Caixin also reported improvement in China with Oct PMI jumping to 50.3 vs 49.3 in Sep on pick up in new orders and output. In Japan, mfg activity shrunk at the fastest pace in three months with Oct PMI of 49.2 vs 49.8 in Sep with softness cited across domestic and export demand impacting sales and output across Auto and Semis.

South Korea mfg PMI also declined reflecting contracting activity for a second straight month with Oct PMI of 48.3, which was unchanged vs Sep. Reports indicated factory activity in Malaysia and Indonesia also contracted in Oct, while Taiwan and Vietnam data showed continued expansion.

Headlines:

Auto

  • BYD revenue eclipses Tesla for first time; shipments in Oct jumped by 66% to more thank 500k
  • Bosch cuts revenue forecast for coming year, layoffs not ruled out
  • Chinese EVs see EU sales slump as tariff row deepens
  • The E.U. is imposing duties on China EVS after trade talks fail; OEMs seen accelerating shipments ahead of tariffs
  • China’s EV market looks headed for year-end sales surge with fewer discounts on expanded subsidies
  • Denso cuts full-year profit forecast by 21%
  • VW sounds the alarm on mass layoffs, three German plant closure and two-year wage freeze
  • German car industry transformation could cost 186,000 jobs by 2035, study finds
  • Ford to halt F-150 Lightning production as EV demand wanes
  • Ford lowers profit outlook amid global price war and over-capacity
  • Italy to cut automotive industry support by $5 billion
  • Stellantis reported 21% drop in 3Q shipments
  • Toyota worldwide output drops for 8th straight month in September
  • Li Auto forecasts 20% increase in 4Q24 shipments

IP&E

  • Amphenol opens new manufacturing facility in Penang
  • TE results and outlook mixed on softer Auto production, destocking in Commercial Transportation and Industrial partially offset by upside in AI

Industrial

  • Boeing union endorses 38% wage hike offer, vote set for Monday
  • China’s Sept industrial profits post steepest fall of the year
  • Philips lowers sales outlook on deteriorating China medical equipment demand

Semiconductors

  • Altera announces 7% to 20% price increases going into effect in November 2024
  • AMD reports slightly better results on continued PC share gains; AI GPU forecast raised by $500M for third time this year
  • Intel 3Q results better than feared; announced another large restructuring and downside to AI chip shipments
  • Intel expands its back-end facility in Chengdu, China despite US China tension
  • Global chip market projected to grow 18.8% in 2024, driven by AI demand; HBM revenue surges 284% says Gartner
  • GlobalFoundries and NXP partner to deliver advanced 22FDX solutions for automotive and IoT markets
  • US finalizes rules to further curb AI investments in China
  • TSMC intends to acquire additional Innolux facilities to support CoWoS expansion
  • TSMC’s CoWoS monthly capacity to reach 65,000 wafers next year amid says DigiTimes
  • TSMC announces 2025 5-10% price increase for leading edge technologies
  • onsemi East Fishkill fab accredited as Trusted Foundry by Department of Defense
  • onsemi results and outlook in-line; SiC growth lower on softer demand in the West offset by strong wins and ramp up in China
  • STMicro sees significant sales declines persisting Into 2025
  • Mobileye’s quarterly revenue beats expectations, despite 50% drop in China
  • South Korea’s chip production falls for first time in 14 months
  • US plans $825M investment for New York semiconductor R&D facility focusing on EUV
  • Samsung says it is making headway in AI chip supply after disappointing results
  • Samsung is rumored to be planning to shut down 50% of its foundry production lines
  • Falling prices and overcapacity may lead to restructuring at Chinese SiC suppliers, according to DigiTimes
  • OpenAI builds first chip with Broadcom and TSMC, scales back foundry ambition
  • Russia uses India to import built-in AI chip servers to circumvent US export restrictions
  • Nvidia plans ARM-based PC platform to rival Intel, AMD according to DigiTimes

Other

  • Apple 4Q outlook disappoints on China weakness
  • Arrow announced large restructuring amid prolonged correction in demand and margin pressure
  • Avnet reported 3QCY upside on strong Asia sales with 4Q revenue outlook in-line despite pronounced weakness in Europe
  • Euro zone inflation picks up, bolstering case for caution in rate cuts

Related

Source: Edgewater Research
Via: https://www.edgewaterresearch.com/

Recent Posts

Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
31
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
73
ECIA September 2026 Industry Pulse electronic component trends and sentiment report

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

12.10.2026
28

Wk 39 Electronics Supply Chain Digest

10.10.2026
31
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
59
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
12
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
65
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
43

Wk 38 Electronics Supply Chain Digest

5.10.2026
37

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved