Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Auto chip market to grow 22% this year

25.5.2017
Reading Time: 2 mins read
A A

source: Electronics Weekly news

Use of passive components is logically linked with IC trends, let’s review the trend in automotive ICs. The automotive IC market is expected to grow  22% this year to a new record high of $28 billion, says IC Insights.

RelatedPosts

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

TDK X Series SMD Varistors for Industrial Transient Protection

After increasing 11.5% in 2014, the automotive IC market declined 2.5% in 2015, but then rebounded with 10.8% growth in 2016.

The sales decline experienced in 2015 was primarily the result of falling ASPs across all the key automotive IC product categories—microcontrollers, analog ICs, DRAM, flash, and general- and special-purpose logic ICs, which offset steady unit growth for automotive ICs that year.

IMG_0628

However, in the second half of 2016, steadily rising ASPs (along with demand for the new automotive systems) helped return the automotive IC market to double-digit growth. In 2017, exceptionally strong increases in DRAM and flash memory prices are expected to help drive the total automotive IC market to an extraordinary increase of 22.4%.

IC Insights recently revised its IC market outlook for 2017 and now shows DRAM average selling prices rising 50% in 2017, NAND flash ASPs increasing 28%, and the average selling price for automotive special-purpose logic devices increasing 34%. These strong ASPs gains, coupled with ongoing system demand, are driving the strong automotive IC market growth this year (Figure 2).

IMG_0629

Collectively, microcontrollers, analog, standard logic, and memory ICs used in automotive applications accounted for only about 8% of total IC marketshare by system type in 2016, but that share is forecast to increase to more than 10% in 2020, when automotive is expected to become the third-largest end-use category for ICs, trailing only the communications and computer segments.

Through 2020, IC Insights anticipates that advanced driver-assistance systems (ADAS) will be the biggest user of automotive ICs. Various ADAS systems are currently helping cars and drivers remain safe on the road and they are proving to be essential building blocks to semi autonomous and autonomous vehicles that are being proposed for the next decade.

 

Related

Recent Posts

Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
31
Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

13.10.2026
17
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
73
Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
11
ECIA September 2026 Industry Pulse electronic component trends and sentiment report

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

12.10.2026
28
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
59
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
12
Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

7.10.2026
14
Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

TDK Expands1608 Inductors for Automotive PoC Filters

6.10.2026
12

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved