Murata has developed an LTCC antenna module for D-band wireless systems, demonstrating communication at 135 GHz, signal transmission with bandwidths up to 8 GHz, and two-dimensional beam control for transmission and reception.
Developed jointly with imec, the module integrates a ceramic substrate, antennas, RF wiring and a beamforming IC for potential use in 6G communications and sub-terahertz sensing.
Key features and benefits
- D-band technology covering the 110–170 GHz frequency band.
- Wireless communication demonstrated at 135 GHz.
- Signal transmission using bandwidths up to 8 GHz.
- Two-dimensional beam control in both transmit and receive operation.
- Integrated antenna, RF interconnects and imec-developed beamforming IC.
- Multilayer ceramic construction based on low-temperature co-fired ceramic technology.
The central development is the combination of D-band operation and transmit-and-receive beam steering on an LTCC platform. The ceramic substrate forms part of the RF architecture, integrating the antennas and signal routing with the active circuitry.
Technical highlights
| Parameter | Value or implementation | Engineering relevance |
|---|---|---|
| Frequency band | D-band: 110–170 GHz | RF architecture |
| Demonstrated communication frequency | 135 GHz | Evaluated operating point |
| Signal bandwidth | Up to 8 GHz | Wideband transmission |
| Beam control | Two-dimensional, transmit and receive | Horizontal and vertical steering |
| Substrate technology | LTCC | Multilayer RF integration |
| Beamforming IC | imec-developed D-band IC | Antenna beam control |
Ceramic substrate and RF integration
The LTCC substrate consists of ceramic sheets carrying wiring that are laminated and co-fired. The module combines this multilayer structure with antennas, RF wiring and a D-band-compatible beamforming IC.
The ceramic material was developed in-house and tailored to the high-frequency application. Dielectric constant and dielectric loss tangent are central material properties in this architecture: dielectric loss tangent relates to signal energy dissipated within the substrate.
At frequencies above 100 GHz, small differences in wiring length and mounting position can materially affect communication performance. Antenna geometry, RF routing and component placement therefore need to be treated as a coordinated design rather than independent layout tasks.
Bandwidth and beam steering serve different functions
The demonstrated 8 GHz bandwidth concerns the frequency span used for signal transmission. It is distinct from the 135 GHz communication frequency and from the wider 110–170 GHz D-band designation.
Two-dimensional beam control directs the radio beam horizontally and vertically. Transmit beamforming concentrates radiation towards the intended communication partner, while receive beamforming controls the reception direction. Supporting both functions is relevant to directional communication at frequencies above 100 GHz.
Typical applications
- Next-generation 6G communications requiring wideband wireless transmission.
- High-speed, high-capacity wireless communication systems.
- Sub-terahertz radar and sensing.
- Integrated sensing and communication, or ISAC, combining communications with detection of the surrounding environment, object positions and movement.
The demonstrated 135 GHz operation, bandwidth up to 8 GHz and two-dimensional beam control make the module a development platform for wideband, directional communications. Radar, sensing and ISAC are prospective applications of the technology.
Design-in notes for engineers
- Treat the antenna, ceramic substrate, RF wiring and beamforming IC as an integrated RF assembly when assessing system architecture.
- Keep the demonstrated communication frequency, signal bandwidth and D-band frequency designation separate when defining system requirements.
- Assess wiring-length differences and mounting variation alongside antenna geometry; these implementation details affect performance at frequencies above 100 GHz.
- Evaluate beam control in both transmission and reception, including horizontal and vertical direction control.
- Validate the integrated RF assembly under the intended operating conditions before schematic, layout or production release.
Development and commercialisation
The module remains in technology development towards practical implementation and volume production. Commercialisation is targeted from 2030 onward, using an LTCC manufacturing process with an established mass-production history.
Further reading
- Murata Develops Millimeter-wave RF Antenna Module for Next Generation High-Speed Wireless Networks
- Approaching the 5G mmWave Filter Challenge
Source
This article is based on the Murata product announcement and official product documentation. Engineers should refer to the current manufacturer datasheet for final design and qualification.
References
- 6G向け100GHz超の高周波帯に対応したアンテナモジュールを開発― 135GHz帯での無線通信動作、最大８GHzの広帯域信号伝送、送受信双方の2次元ビーム制御を実証 ―, Murata Manufacturing Co., Ltd., 5 October 2026.
- https://corporate.murata.com/en-global/newsroom/news/company/general/2026/1005 Murata Manufacturing Co., Ltd., 5 October 2026.
