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    Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

    Bourns Planar Transformers for SiC and GaN Gate Driver Isolation

    100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

    Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

    KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

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    DigiKey Releases Season Two of Sustainable Futures Series

    Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

    Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters

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    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

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Bourns Ads Two New SMD Fuse Families

15.2.2024
Reading Time: 2 mins read
A A

Bourns is pleased to announce the introduction of the new Model SF-0603SP-R and SF-1206S-R Series SMD Fuses to expand its portfolio of SinglFuse™ SMD Fuses.

The new Model SF-0603SP-R and SF-1206S-R families are intended for use in a variety of data center, industrial, medical (low to medium risk*), telecom and Battery Management Systems (BMS) applications.

RelatedPosts

Bourns Planar Transformers for SiC and GaN Gate Driver Isolation

Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters

Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

Bourns continues to broaden its portfolio of SinglFuse™ SMD Fuses to address the growing need for effective circuit protection in a variety of applications including automotive, telecom and networking equipment, PCs and monitors, server farms, portable memory, portable electronics, gaming systems, robotics, smart appliances, battery chargers and industrial controllers.

Features

  • Metal foil chip design with high operating temperature up to +125 °C
  • EIA 0603 & 1206 footprint
  • UL 248-14 recognized (E198545)
  • RoHS compliant and halogen free

Applications

  • Data center
  • Industrial
  • Medical (low to medium risk)*
  • Telecom
  • Battery Management Systems

Related

Source: Bourns

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