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    Vishay Releases High‑Current Radial Inductors up to 209 A

    May 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Passive Components Enable Safe and Reliable ADAS Architectures

    Current Sense Transformer Datasheet and Design‑in Guide

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    Exxelia Extends Temperature Range of its PP Film Capacitors to 140C

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Bourns Ads Two New SMD Fuse Families

15.2.2024
Reading Time: 2 mins read
A A

Bourns is pleased to announce the introduction of the new Model SF-0603SP-R and SF-1206S-R Series SMD Fuses to expand its portfolio of SinglFuse™ SMD Fuses.

The new Model SF-0603SP-R and SF-1206S-R families are intended for use in a variety of data center, industrial, medical (low to medium risk*), telecom and Battery Management Systems (BMS) applications.

RelatedPosts

Bourns Releases Compact High Current Shielded Power Inductors

Bourns Expands its Modular Contacts for Power-Dense Systems

Bourns Expanded Semi-Shielded Low Profile Automotive Power Inductor

Bourns continues to broaden its portfolio of SinglFuse™ SMD Fuses to address the growing need for effective circuit protection in a variety of applications including automotive, telecom and networking equipment, PCs and monitors, server farms, portable memory, portable electronics, gaming systems, robotics, smart appliances, battery chargers and industrial controllers.

Features

  • Metal foil chip design with high operating temperature up to +125 °C
  • EIA 0603 & 1206 footprint
  • UL 248-14 recognized (E198545)
  • RoHS compliant and halogen free

Applications

  • Data center
  • Industrial
  • Medical (low to medium risk)*
  • Telecom
  • Battery Management Systems

Related

Source: Bourns

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