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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

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    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

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Bourns Ads Two New SMD Fuse Families

15.2.2024
Reading Time: 2 mins read
A A

Bourns is pleased to announce the introduction of the new Model SF-0603SP-R and SF-1206S-R Series SMD Fuses to expand its portfolio of SinglFuse™ SMD Fuses.

The new Model SF-0603SP-R and SF-1206S-R families are intended for use in a variety of data center, industrial, medical (low to medium risk*), telecom and Battery Management Systems (BMS) applications.

RelatedPosts

Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

Bourns Expands Compact Incremental Potentiometer Offering

Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

Bourns continues to broaden its portfolio of SinglFuse™ SMD Fuses to address the growing need for effective circuit protection in a variety of applications including automotive, telecom and networking equipment, PCs and monitors, server farms, portable memory, portable electronics, gaming systems, robotics, smart appliances, battery chargers and industrial controllers.

Features

  • Metal foil chip design with high operating temperature up to +125 °C
  • EIA 0603 & 1206 footprint
  • UL 248-14 recognized (E198545)
  • RoHS compliant and halogen free

Applications

  • Data center
  • Industrial
  • Medical (low to medium risk)*
  • Telecom
  • Battery Management Systems

Related

Source: Bourns

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