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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

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    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

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    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

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Bourns Ads Two New SMD Fuse Families

15.2.2024
Reading Time: 2 mins read
A A

Bourns is pleased to announce the introduction of the new Model SF-0603SP-R and SF-1206S-R Series SMD Fuses to expand its portfolio of SinglFuse™ SMD Fuses.

The new Model SF-0603SP-R and SF-1206S-R families are intended for use in a variety of data center, industrial, medical (low to medium risk*), telecom and Battery Management Systems (BMS) applications.

RelatedPosts

Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

Bourns Current Sense Resistors Reach 36 W

Bourns Releases 5 W Wide-Terminal Current Sense Resistors

Bourns continues to broaden its portfolio of SinglFuse™ SMD Fuses to address the growing need for effective circuit protection in a variety of applications including automotive, telecom and networking equipment, PCs and monitors, server farms, portable memory, portable electronics, gaming systems, robotics, smart appliances, battery chargers and industrial controllers.

Features

  • Metal foil chip design with high operating temperature up to +125 °C
  • EIA 0603 & 1206 footprint
  • UL 248-14 recognized (E198545)
  • RoHS compliant and halogen free

Applications

  • Data center
  • Industrial
  • Medical (low to medium risk)*
  • Telecom
  • Battery Management Systems

Related

Source: Bourns

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