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    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

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    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

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    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

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    Wk 35 Electronics Supply Chain Digest

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Bourns Releases Two New Automotive SMD Fuse Families

16.6.2021
Reading Time: 2 mins read
A A

Bourns is pleased to announce the introduction of two new families of AEC-Q200-equivalent compliant* SMD fuses to complement its already successful line of SinglFuse™ SMD Fuse products.

The new Model SF-0603SA-M and S F -120 6SA – M series utilize Bourns’ popular multilayer ceramic design for enhanced voltage and current handling capabilities in small 0603 and 1206 package sizes. Both families are fully compliant with Bourns’ internal AEC-Q200 equivalent test procedures to help ensure performance robustness in certain harsh environments including automotive, industrial, low to medium risk medical**, telecom and Battery Management Systems applications, among others.

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Bourns continues to broaden its portfolio of SinglFuse™ SMD Fuses to address the growing need for effective overcurrent protection in a variety of applications including transportation, telecom and networking equipment, computing and server storage, portable memory, handheld electronics and gaming systems, smart appliances, battery charging and power management, robotics and industrial automation.Bourns® SinglFuse™ SMD Fuse products are UL 248-14 listed, RoHS compliant*** and halogen free****.

Features

  • Slow blow fusing speed
  • EIA 0603 & 1206 footprint
  • AEC-Q200-equivalent compliant*
  • UL 248-14 listed
  • RoHS compliant*** and halogen free****
  • Automotive grade

Applications

  • Industrial
  • Medical (low to medium risk)**
  • Telecom
  • Battery Management Systems (BMS)
  • Automotive

* Meets Bourns’ internal AEC-Q200 equivalent test plan.
** Bourns® products have not been designed for and are not intended for use in “lifesaving,” “life-critical” or “life-sustaining” applications nor any other applications where failure or malfunction of the Bourns® product may result in personal injuryor death. See Legal Disclaimer Notice http://www.bourns.com/docs/legal/disclaimer.pdf.
*** RoHS Directive 2015/863, Mar 31, 2015 and Annex.
**** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less

Related

Source: Bourns

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