TPC Technical Program Committee of the next 3rd PCNS Passive Components Networking Symposium scheduled for Sep 7-10th 2021 in Milano,...
Read moreOn February 18th, 2021 in a kick-off meeting opened by The Ambassador of Norway in Norway, Her Excellency Mrs. Else...
Read moreA new consortium funded by an award from the U.S. Department of Defense has selected Purdue University to co-lead its...
Read moreExxelia, a leading manufacturer of complex passive components and sub-systems dedicated to harsh environments, launches the Cubisic SLP product series,...
Read more24th annual CMSE Components for Military & Space Electronics virtual conference that will be held April 19-23, 2021 announced agenda...
Read moreWith the increasing use of low-voltage, high-current loads such as FPGAs within spacecraft avionics, engineers are increasingly having to design-in...
Read moreVishay Intertechnology introduces a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) with a lead (Pb)-bearing termination finish suitable...
Read morePCNS Passive Components Networking Symposium organizing committee is pleased to announce Call for Papers for the 3rd international symposium dedicated...
Read moreAlexander Teverovsky, Jacobs Engineering, Inc, NASA GSFC published presentation that provides a comparative analysis of degradation processes, failure modes and...
Read moreSERMA Microelectronics, a subsidiary of SERMA Group, finalised the purchase of TFP (THIN FILM PRODUCTS), the French leader in the...
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