Industrial Applications Demand More from Interconnects in Next-Gen Designs by Samtec Tuesday, November 11, 2025 · 5:00 p.m. CET Need to specify interconnects for industrial applications like automation, robotics, embedded vision, IoT, lighting, smart cities, grids, or factories? Join us for a presentation offering practical recommendations and guidelines to EOEM engineers and designers on selecting […]
Würth Elektronik Webinar: Impedance is for everyone! Wed, Nov 12, 2025 11:00 AM - 12:00 PM CET As data rates increase, so do the demands on PCB design. To ensure that signals are transmitted on the PCB without distortion, the impedance requirements of the assembly or application must be properly considered in the PCB design. […]
VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review […]
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