Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Influence of Shielding Materials on Shielding Effectiveness

22.5.2026
Reading Time: 5 mins read
A A

This article provides an overview of impact of shielding materials on shielding effectiveness. The post is based on Würth Elektronik‘s “Reference Guide ABC of Shielding” that can be ordered from WE website here. Published under permission by Würth Elektronik.

The fundamental principle of shielding enclosures against electromagnetic fields is to construct a Faraday cage around an electrical device.

RelatedPosts

EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

EMC‑Compliant PCB and Connector Design Guidelines

Mastering Galvanic Isolation in Power Electronics: Methods, Standards, and Implementation

If PCBs and internal cabling are meticulously designed, the amount of enclosure shielding required can be significantly reduced. However, if it becomes evident that enclosure shielding is necessary, the design of the enclosure to meet EMC requirements will become a crucial cost factor for the product.

A shielded enclosure must be constructed using materials that possess the requisite electrical properties and adhere to the application-specific requirements. Discontinuities, such as housing openings, seams, and sheet metal overlaps, should be minimized and designed in a manner that maintains the effectiveness of the housing shielding.

This can be achieved through the appropriate use of EMI shielding gaskets, ventilation, window shields, and shielded and filtered peripheral cables. The materials employed in the manufacture of enclosures include metal sheet and foil, non-metallic materials like plastic materials with conductive coatings, conductive plastics, and various composites.

Metal Sheets

Metal sheets are effective in shielding electrical (high-impedance) fields due to their high conductivity, as illustrated in Figure 1.

Fig.1. Shielding effectiveness with copper sheet above frequency for electric and magnetic fields and plane waves

The shielding effect for electric fields is infinite for direct current and decreases with increasing frequency. However, magnetic fields are more challenging to shield. As frequency decreases, non-magnetic materials like aluminum exhibit reduced reflection and absorption losses, making it difficult to shield magnetic fields using them.

At high frequencies, the shielding effectiveness is high due to reflection and absorption losses, so the choice of materials becomes less critical. Regarding plane waves, magnetic materials offer better absorption attenuation, while well-conducting materials provide better reflection attenuation. Table 1. provides a qualitative overview of these parameters.

Tab. 1.:  Overview of the shielding attenuation properties of materials depending on the field types.

Some of the values in Table 1. are quite high because they were measured in the laboratory under ideal conditions for comparison purposes and are rarely achieved in practice. It is often assumed that materials with sufficient structural stiffness also have sufficient thickness to achieve a sufficient shielding effect. However, this is not always the case for devices operating in the low-frequency range (typically <100 kHz). At these low frequencies, it is necessary to use a highly permeable material to achieve sufficiently high shielding effectiveness against magnetic fields.

Plastics with Shielding Attenuation Properties

Plastics, synthetic materials derived from raw materials called monomers, exhibit diverse physical properties like melting point, strength, and formability. However, these properties can hinder their processing and usability. Composite materials have emerged as a solution to address these shortcomings. Composite materials are combinations of two or more materials designed to achieve a property that none of the individual materials can provide. This combination often results in enhanced strength, but it can also increase electrical conductivity and improve electromagnetic shielding properties.

To improve the electrical and electromagnetic properties of plastics, graphite mats or other materials can be used, such as the addition of conductive fillers. Typical conductive fillers are graphite flakes, metal-coated graphite fibres, and metal flakes or fibres. The resistivity of carbon fibre composites ranges from 4 mΩ/cm to some 100 mΩ/cm, depending on the number of layers and their weaving angle.

This is three to four orders of magnitude greater than copper or aluminum. Thus, most composites pose serious problems for electrical connections. The establishment of low-impedance and long-term reliable electrical contact between a housing ground and the electronics is essential for a functioning EMC concept. The conductivity of the housing surface can also be achieved by integrating a conductive screen or by coating the housing with conductive paint. The technologies used to apply conductive enclosure coatings include flame spraying, arc spraying, vacuum metallization, painting with conductive paints, and covering with conductive foil. This can further improve the surface conductivity of composite materials. Surface resistance can thus be reduced to 5 to 100 mΩ/cm.

All these plastics with shielding attenuation properties offer a certain degree of attenuation within a limited frequency range. Table 2. compares the conductivity and magnetic permeability of various materials. It’s evident that only materials containing ferromagnetic components exhibit effective attenuation of low-frequency magnetic field components, as only these have a magnetic permeability exceeding 1.

Tab. 2.: Conductivity and magnetic permeability of different materials

Plastic housings have a crucial aspect to consider: their interference resistance against electrostatic discharges. Materials with a specific surface resistance of less than 1 · 107 Ω/square can accumulate static charge if electrically connected to a conductive structure like a wire, allowing the charge to flow. Conversely, materials with a resistivity of more than 1 · 1013 Ω/square can build up static charge that remains undissipated even when the housing is grounded by a conductor.

Graphite-reinforced materials are generally conductive enough to prevent static charge buildup when graphite particles protrude through the plastic to the surface. In contrast, epoxy resin surface coatings lack conductivity, necessitating an additional conductive coating in certain cases.

Related articles:

  • Electromagnetic Housing Shielding and Its Effectiveness
  • Parameters of Shielding Attenuation

Related

Source: Reference Guide on Shielding

Recent Posts

Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

24.8.2026
48

Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

5.8.2026
174

EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

16.7.2026
320

Square-Wave Harmonics and RMS Currents in Power Converters

14.7.2026
196

Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

9.7.2026
244

From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

7.7.2026
146

Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

1.7.2026
283

Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

29.6.2026
96

Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

24.6.2026
82

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved