Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    EMC‑Compliant PCB and Connector Design Guidelines

    Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Bourns Releases Automotive Gate Driver Transformer for Isolated Power

    Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

    Knowles Expands High‑Q Ceramic Core Inductors for RF designs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    EMC‑Compliant PCB and Connector Design Guidelines

    Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Bourns Releases Automotive Gate Driver Transformer for Isolated Power

    Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

    Knowles Expands High‑Q Ceramic Core Inductors for RF designs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

KYOCERA AVX Releases Miniature RF MLCCs for Communication Applications

28.8.2024
Reading Time: 2 mins read
A A

Designed to satisfy communications market demand for smaller RF capacitors capable of repeatable RF performance, the new KGU Series C0G (NP0) RF MLCCs pack features including ultra-low ESR, high power, high Q, high SRF, and tight tolerances into miniature EIA chip sizes ranging from 01005 to 0805.

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new ultra-low-ESR KGU Series C0G (NP0) RF multilayer ceramic chip capacitors (MLCCs).

RelatedPosts

KYOCERA 10 µF 0201 MLCC Brings High‑Capacitance into Mobile Designs

KYOCERA AVX Extends MLV Varistors for 48V Automotive Protection

Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

Inspired by growing communications market demand for smaller RF capacitors that deliver repeatable RF performance, the new KGU Series RF MLCCs pack multiple performance advantages optimized for communications applications into four miniature EIA chip sizes ranging from 01005 to 0805.

The series features Class I C0G (NP0) ceramic dielectric materials, which are one of the most stable capacitor dielectrics available — exhibiting a temperature coefficient of capacitance (TCC) of 0±30ppm/°C and essentially zero voltage coefficient, and base metal electrodes made of copper plated with a tin/nickel alloy, which deliver high capacitance-voltage (CV) capabilities in small case sizes. It also exhibits ultra-low equivalent series resistance (ESR), high power, high Q, high self-resonant frequencies (SRF), and tight tolerances — all of which are beneficial for countless communications applications.

KGU Series RF MLCCs are currently available in four miniature EIA chip sizes (01005, 0402, 0603, and 0805) and rated for 16–250V, 0.1–100pF, tolerances as low as ±0.05pF, and operating temperatures extending from -40°C to +125°C. Ideal applications for the series include filter networks, matching networks, high-Q frequency sources, and tuning, coupling, bypass, and DC blocking circuits in cellular base stations, 802.11 Wi-Fi networks, subscriber-based wireless devices, and broadband wireless, satellite communications, and public safety radio systems.

Additional features of the new KGU Series RF MLCCs include RoHS compliance, resistance to thermal shock, long lifetime performance, a lack of both aging and piezoelectric effects, and tape and reel packaging for automated assembly.

“Our new KGU Series C0G (NP0) RF MLCCs provide customers in the communications market with a collection of performance characteristics optimized to satisfy their application demands, including ultra-low ESR, high repeatability, high power, high Q, high SRF, tight tolerances, and miniature EIA chip sizes,” said Mohammed Abu-Naim, RF Product Manager, KYOCERA AVX.

Source: KYOCERA AVX

Related

Recent Posts

Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

23.6.2026
7

High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

23.6.2026
15

Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

22.6.2026
16

Knowles Expands High‑Q Ceramic Core Inductors for RF designs

19.6.2026
21

TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

18.6.2026
102

Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution

17.6.2026
43

Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

17.6.2026
31

YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

17.6.2026
29

Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN

17.6.2026
61

Upcoming Events

Jun 30
17:00 - 18:00 CEST

PSMA Capacitor Committee Webinar: High Voltage Pulse Capacitors

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version