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    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

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    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Trending Tags

    • Ripple Current
    • RF
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    • Snubber
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Message of the day from Taiwan: passive components demand picking up

4.9.2019
Reading Time: 1 min read
A A

Source: DigiTimes news

Taiwanese passive component suppliers have seen inventory approach healthy levels after two to three quarters of correction.

RelatedPosts

SCHURTER THT DIP Switches Support Hardware-Level Configuration

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

But while their third-quarter shipments are expected to be robust, they remain cautious about the last quarter of the year. In the handset market, Asustek Computer might have been over-cautious about sales of its new gaming smartphone. Asustek reportedly has seen tight supply of its ROG Phone II, as it had failed to place sufficient orders with its handset OEM partner prior to launch.

Passive component demand picking up: Demand for MLCCs, chip resistors, as well as other passive components, has started picking up substantially, according to industry sources in Taiwan.

Asustek to account for over 50% of global gaming smartphone shipments in 2019: Asustek is expected to ship over 400,000 units of its ROG Phone II in 2019, accounting for over 50% of the global gaming smartphone shipments in the year, according to industry sources.

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