Page 276 – Passive Components Blog

Tame-Component and its partners are launching a project to create a medical grade for electronic components. Through it, these players ...

$A computational simulation at NTU showing how h-BN fractures. The material's intrinsic toughness arises from slight asymmetries in its atomic structure (left), which produce a permanent tendency for moving cracks to follow branched paths (right); Credit: NTU Singapore$

Researchers Demonstrated Toughest 2D Nanomaterial Ideal for Tear-Resistant Flexible Electronics

16.2.2022

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A team of scientists led by Nanyang Technological University (NTU Singapore) and Rice University in the US, has uncovered the ...

Yageo Extended its High Frequency MLCC Capacitors with 0402 Size for Automotive and 5G market

3.6.2021

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YAGEO Group, the global leading passive component service provider, has extended the product range of automotive grade high frequency MLCC, ...

Passives Supply May be Impacted by Malaysia Lockdown

3.6.2021

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National governments in Southeast Asian countries, including Thailand, Vietnam, and Malaysia, have been instituting increasingly stringent pandemic control measures in ...

Figure 1: Inductor Using Ferrite and Iron Powder Technology; source: Chillisin

Miniaturization – Downsizing of Inductors

2.6.2021

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Space on a PCB is in short supply, but the demands placed on the technical properties of inductive components continue ...

‘Perfect Storm’ Creates Electronic Component Supply Chain Shortages

2.6.2021

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We’re in the midst of what could be called a “perfect storm” that is creating significant supply chain shortages for ...

3rd PCNS Registration is Now OPEN !

11.10.2021

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3rd PCNS Passive Components Networking Symposium is now open for on-line registration. The third PCNS is organized as a hybrid ...

The new interposer design with an embedded capacitor provides a notable reduction in area requirements and interconnect length, leading to lower wiring resistance and parasitic capacitance. MPU: Microprocessing unit; DRAM: Direct random-access memory. Credit: The 2021 IEEE Electronic Components and Technology Conference

Embedding Capacitors into Interposers

2.6.2021

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Scientists at Tokyo Institute of Technology develop a 3D functional interposer -the interface between a chip and the package substrate--containing ...