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Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
Reading Time: 5 mins read
A A
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray has developed a prototype film capacitor using a proprietary heat-resistant dielectric film and demonstrated inverter operation at 150°C.

The technology addresses a thermal constraint in electric-mobility power conversion: the capacitor’s heat resistance can limit the inverter’s cooling and packaging design. Thermal simulations indicate potential to halve the size of the heat-dissipation structure in an electric-mobility power control unit.

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Key features and benefits

  • Heat-resistant dielectric film developed for 150°C film capacitors.
  • Stable operation demonstrated in a prototype inverter at 150°C.
  • Potential to halve heat-dissipation structure size in a simulated electric-mobility power control unit.
  • Development directed towards air-cooled power control units for electric vehicles and flying cars.
  • Joint development and evaluation by Toray and Nagoya University towards commercialisation.

Technical highlights

The component is a prototype film capacitor, with the new technology centred on its dielectric film. The practical advance is operation within a high-temperature inverter, rather than an isolated material-temperature demonstration.

Joint research with Professor Masayoshi Yamamoto of Nagoya University’s Institute of Materials and Systems for Sustainability demonstrated stable operation of the capacitor in a prototype inverter at 150°C.

ParameterValue or statusContext
ComponentPrototype film capacitorInverter evaluation
DielectricProprietary heat-resistant film150°C development
Inverter test temperature150°CStable operation
Heat-dissipation structurePotential halving of sizeThermal simulation
Development stageDevelopment and evaluationTowards commercialisation

The thermal result concerns the heat-dissipation structure, not a halving of capacitor dimensions or total inverter size. It is a simulated packaging opportunity for a power control unit using more heat-resistant film capacitors.

The size-reduction calculation was based on an electric-mobility power control unit assessment dated September 30, 2026. The inverter operating demonstration and the cooling-structure simulation are distinct results: one establishes prototype operation at elevated temperature; the other evaluates the scope for changing the system’s thermal architecture.

Typical applications

Target applications include:

  • Electric-vehicle inverters and air-cooled power control units.
  • Flying-car drive systems and power control units.
  • Electrified aircraft and other next-generation mobility systems.

In these systems, film capacitors stabilise power within the inverter, which converts direct current into alternating current to control motors. Increasing the capacitor’s heat resistance addresses a component-level constraint on the temperature at which the surrounding power-conversion system can operate.

Application fit

The 150°C inverter demonstration is relevant to mobility systems where higher-output drive electronics increase the thermal demands placed on passive components. The development also supports work on reducing the size and weight of air-cooled power control units.

For flying cars, heat-dissipation structures are particularly important because their size and weight affect flight range. A capacitor capable of operating in a hotter inverter environment creates scope to reconsider cooling-system dimensions rather than retaining a thermal architecture governed by the capacitor’s temperature constraint.

The development is supported by the New Energy and Industrial Technology Development Organization through a project developing dielectric film for 150°C film capacitors. Toray and Nagoya University are continuing development and evaluation towards commercialisation.

Design-in notes for engineers

  • Treat dielectric heat resistance, complete-capacitor performance and inverter operating temperature as separate design considerations.
  • Evaluate cooling-structure changes at power-control-unit level rather than applying the simulated size reduction directly to the capacitor or complete inverter.
  • Assess the capacitor and cooling architecture together before fixing the mechanical layout.
  • Keep the demonstrated prototype operation distinct from the requirements for a production component.
  • Validate final selection and thermal design under the actual operating conditions before production release.

Further reading

  • DC-Link Capacitors
  • Predicting Metal Film Capacitor Lifetime Using Thermal Simulation
  • Electrification Raises Demands on DC-Link Capacitors

Source

This article is based on the Toray product announcement and official product documentation. Engineers should refer to the current manufacturer datasheet for final design and qualification.

References

  1. Toray Demonstrates 150°C Inverter Operation with Film Capacitor that Could Halve Heat-Dissipation Structure Size for Next-Generation Mobility, Toray Industries, Inc., October 8, 2026.

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