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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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Panasonic extends OS-CON Polymer-Aluminium Solid Capacitor range

9.3.2017
Reading Time: 1 min read
A A

source: Electronics Sourcing news

Panasonic Automotive & Industrial Systems Europe, has recently extended its industry-leading product line of OS-CON Polymer-Aluminium-Solid Capacitors with three new series for environments requiring high temperatures of up to 125°C, e.g. heavy industrial and stressful environments.
The products benefit from a small footprint, great ESR values, low power consumption, and are able to withstand high humidity (95°C/95% – 1.000 hrs). Furthermore, the capacitors feature a high ripple current with a tiered ripple current rating, so in applications which briefly touch 125°C the devices utilize the lower ripple current rating while offering higher rating for the majority of the time.

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The SVF and SVPK components can achieve 10.000h at 105°C which delivers on the extended lifetime that polymer technology promises. The SVF series offers higher capacitance (1000 uF) and ripple current rating (5 Arms) while the SVPK series is even more high-end, packing higher capacitance within the same case size. The components are ideally suited for passing and/or withstanding large slugs of current and can be used for holding a large amount of charge. All the new series are offered in surface-mount and through-hole versions and deliver a value proposition in terms of part count reduction and space limits.

Remarks Mustafa Khan, European Product Manager for Polymer Capacitors at Panasonic: “Our OS-CON range of solid capacitors utilize aluminium and highly conductivity polymer material to offer low ESR, excellent noise reduction and ripple current capabilities. These series target applications that require tough humidity and load profile while minimizing land pattern usage on the PCB.”

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