• 13:00–14:00 – Workshop I: Passive Components Technologies Update; Design Review of EMI Filter for Power Electronics Speaker: Frank Puhane, Würth Elektronik eiSos GmbH & Co. KG
• 14:30–15:50 – Workshop II: Selection, Procurement, and Testing of Passive EEE Components for Harsh Environments Speaker: Manuel Sánchez, ALTER TECHNOLOGY
• 16:10–17:30 – Centro Nacional de Aceleradores Tour
•  

Wednesday 10th September – Conference & Networking

• 09:00–09:30 – Welcome by University of Seville, ALTER TECHNOLOGY, and EPCI
• 09:30–09:55 – Keynote I: European Passive Components Market – Speaker: Luca Primavesi, Itelcond president and EPCIA member
• 09:55–10:00 – EPCIA Student Awards Ceremony
• 10:00–10:30 – Speakers Introduction
• 11:00–12:00 – TPI Flash Presentations (5 min each)
• 12:00–12:30 – Keynote II: Quality Challenges and Risk Mitigation for Passive Components in Harsh Environments Speaker: Antonio Rodriguez Arenas, ALTER TECHNOLOGY
•  
• 13:20–14:35 – Session I: Harsh Applications – Chair: Frank Puhane
• 1.1. Thermoset Polymer Dielectric Capacitors – Angelo Yializis, Polycharge Inc.
• 1.2. Tantalum Capacitor Technology Advantages for Harsh Environment– Michel Bouvier, Vishay
• 1.3. Silicon Capacitors Reliable Performance in Harsh Conditions – Enzo Darcy, Murata Europe
•  
• 15:05–15:35 – Keynote III: Environmental Performance of Polymer Capacitors Speaker: Philip Lessner, USA
•  
• 15:35–17:15 – Session II: Quality & Reliability – Chair: Manuel Sánchez
• 2.1. E-Textile SMD-Ribbon Joints Protections Against Sweat – Martin Hirman, University of West Bohemia
• 2.2. New Generation of EPN Metallized Film Capacitors for Solving High Temperature and High Power Density Requirements – Manuel Gómez, TDK Malaga
• 2.3. Protecting the Quality & Reliability of Passive (and Active) Components: the J-STD-075 PSL Classification & Labeling – Arnaud Grivon, Thales Global Services
• 2.4. Lifetime Assessment for Capacitors in EPS Application – Krzysztof Ptak, Nexteer Automotive
•  
• 17:35–19:15 – Session II (cont.)
• 2.5. Validation of the New IRCA Pure-Polyimide Flexible Heater for High-Reliability and High-Performance Markets – Alessandra Marcer, IRCA S.p.A.
• 2.6. Life Cycle Assessment of a Graphene Supercapacitor: Environmental Hotspots and End-of-Life Strategies – Gianmarco Gottardo, Politecnico di Milano
• 2.7. OUTSTANDING PAPER AWARD: Capacitor Degradation and Failure Mechanisms: Exploring Different Causes Across Technologies – Frank Puhane, Würth Elektronik
• 2.8. Beyond 85/85: Towards Realistic Lifetime Estimation of Polypropylene Film Capacitors in Humid Environments – Massimo Totaro, KEMET YAGEO
•  
• 19:15–21:00 – YAGEO Welcome Drink
•  

Thursday 11th September – Panel Discussion & Sessions

• 09:00–10:30 – Special Session: AI and its Consequences – Chair: Tomas Zednicek
• AI 1. Defect Detention during the Cross-Sectional analysis for Electronics with Computer Vision – Mari Carmen López López (presented by Fernando Romero Madera & Carmen Galán Cebrero). ALTER Technology, Spain
• AI 2. Passive Components in AI Systems – Slavomír Pala, KYOCERA AVX
• AI 3. AI Hardware Development and Its Consequences for Passive Electronic Components – Tomas Zednicek, EPCI, Czechia
•  
• 11:00–12:30 – Panel Discussion: AI and Passive Components
•  
• 13:20–13:50 – Keynote IV: Space Evaluation Testing on SAW Filter Based on POI Technology – Kaoutar Zeljami, ALTER Technology, Spain
•  
• 13:50–15:30 – Session III: New Development – Chair: Frank Puhane
• 3.1. Textile-Based Antennas – Tomas Blecha
• 3.2. BEST PAPER AWARD: New Construction and Packaging Process for Highest Voltage Aluminium Polymer Electrolytic Capacitor – Tim Kruse, SDU Denmark
• 3.3. A New Approach to the Design of High Precision Integrated Resistive Voltage Dividers – Stephen Oxley, TT Electronics, UK
• 3.4. OUTSTANDING PAPER AWARD: Revolutionizing High Frequency Applications: 3-Terminal XG3 Eulex Gap Capacitor – Mark Simpson, Quantic Eulex, USA
•  
• 16:00–17:40 – Session IV: Materials & Processes – Chair: Tomas Blecha
• 4.1. Flaked Tantalum Powders: High Capacitance Powders for High Reliable Tantalum Capacitors – Gordon Smith, GAM, USA
• 4.2. Reliability of E-Textile Conductive Paths and Passive Component Interfaces – Julie Hladikova, University of West Bohemia
• 4.3. Layer-by-Layer Fabrication of Thin Polypropylene-based Dielectrics – Bartosz Gackowski, SDU, Denmark
• 4.4. Development and Prototyping of Nitrogen-Doped Graphene Supercapacitors – Veronika Šedajová, Palacký University Olomouc, Czechia
•  
• 18:00–19:30 – ALTER TECHNOLOGY Test Facility Tour
•  
• 20:00–23:00 – Murata Gala Dinner
•  

Friday 12th September – Sessions & Closing

• 09:00–10:40 – Session V: Applications – Chair: Francisco Rogelio Palomo Pinto
• 5.1. High-Performance Component Strategies to Address Thermal and Frequency Challenges in Base Stations – Che Wei Hsu, Murata Europe
• 5.2. Automotive Polymer Tantalum Capacitors beyond AEC-Q200 – LEO Satellite – Cristina Caetano, KEMET YAGEO, Portugal
• 5.3. Improving Switched-Mode Power Supplies Performance with Modified Thermal Interface Material – Victor Solera, University of Valencia; Spain
• 5.4. Resonant Capacitors in High-Power Resonant Circuits – Moaz ElGhazali, Murata Europe
•  
• 11:10–12:50 – Session V: Design & Construction – Chair: Tomas Zednicek
• 6.1. Qualification of Commercial Off-The-Shelf Supercapacitors – David Latif, EGGO Space, Czechia
• 6.2. Experimental Evaluation of Wear Failures in SMD Inductors – Masaaki Tsujii, Murata, Japan
• 6.3. How to Manage Leakage Current and Self Discharge of EDLC Capacitors – Gerald Tatschl, Vishay Austria
• 6.4. Advancements in Flexible End Terminations for High-Reliability Passive Components in Electrified Vehicles – Dean Buzby, Heraeus, USA
•  
• 12:50–13:00 – Best Paper Awards & Closing Ceremony