Smiths Inteconnect announced today the introduction of its new Planar X Series of RF filter solutions with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku Band). Leverages existing thick film process technology on various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution.
The new Planar X Series is part of an overarching initiative that entails the creation of first-class board level ceramic based thick film RF filters, designed and tested to support various applications markets.
The small footprint, light weight and surface mountable configuration allow for high volume pick and place applications and make Planar X Series ideal for SATCOM, Radar and Broadcasting industries.
“Planar X Series compliments our broad portfolio of RF and Microwave components with the latest technology in RF filters, offering premium performance in a small package,” says Paul Harris, Sales and Marketing VP at Smiths Interconnect.
“The technology has proven reliable in the most demanding environments building upon years of high reliability as a supplier of quality board level components. The addition of the planar filter technology is a natural progression to our existing RF filter product portfolio and Smiths Interconnect is excited to offer this capability in combination with value added testing services”.
With the Planar X Series Smiths Interconnect leverages existing thick film process technology on various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution offering:
- Compact size and light weight, resulting in reduced overall system mass in critical space applications
- Excellent rejection characteristics, providing best in class RF performance
- Robust materials, suitable for harsh environment
- Integration capabilities