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e-PassiveBlog
How a Digital Structural Twin Can Predict Tantalum Capacitor Reliability
This article written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, shows how a simple mechanical test — the stress–strain...
Read moreDetailsTapped Inductor Buck Converter Fundamentals
This article based on video tutorial by prof. Sam Ben-Yaakov explains fundamentals, benefits and design notes related to tapped inductor...
Read moreDetailsMolecular Memristor Shows Record 145 kH Emergent Inductance
Researchers from RIKEN Pioneering Research Institute, Nagoya University, and Tohoku University demonstrated in article published by Nature that a molecular...
Read moreDetailsPlanar vs Conventional Transformer: When it Make Sense
This article based on Frenetic webinar summarizes a practical design workflow using Frenetic AI, Frenetic Simulator and the new Planar...
Read moreDetailsEnergy Localization in Tantalum Anode Formation: A Structural Perspective
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, provides deep inside explanation of energy dissipation during formation...
Read moreDetailsModeling Fringing Field Losses in Inductors & Transformers
Fringing field effects at air gaps represent a significant but often underestimated source of additional winding losses in magnetic components....
Read moreDetailsMiniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the intricate process of miniaturizing tantalum...
Read moreDetailsHeatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Read moreDetailsMurata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%
Murata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs) that dramatically reduces packaging material...
Read moreDetailsWhen More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes
This article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the significance of the metallic...
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