Skeleton Technologies has introduced GrapheneUPS, a high‑density double‑conversion UPS system aimed at AI data centers that need both continuous power...
Read moreDetailsThe move toward 800 V DC power architectures is forcing EMC filter design to become more rigorous, not just in...
Read moreDetailsTDK has introduced the B25696H series of high-frequency DC-link film capacitors, targeting next‑generation SiC‑based power converters where low inductance and...
Read moreDetailsMurata has introduced GCJ21BD72A225KE02, an automotive‑grade soft‑termination multilayer ceramic capacitor (MLCC) that delivers World First 2.2µF at 100 V DC...
Read moreDetailsMurata Manufacturing has signed a memorandum of understanding (MOU) with Xona Space Systems to jointly develop next-generation satellite positioning, navigation,...
Read moreDetailsBourns has released two custom magnetic components, the MAG‑3002584 inductor and the MAG‑3002585 four‑phase line choke, originally developed for Texas...
Read moreDetailsThe MB‑Series Pt‑RTD temperature sensors from YAGEO Group Nexensos are designed for demanding, high‑volume applications that require accurate temperature measurement,...
Read moreDetailsNvidia’s Vera Rubin VR200 NVL72 AI rack uses an estimated 182% more MLCC value than its GB300‑based predecessor, turning multilayer...
Read moreDetailsStackpole Electronics has introduced the HCC series of high current over 1400A busbar shunt resistors, targeting current measurement in battery...
Read moreDetailsTecate Group has introduced a new series of 2.3 V supercapacitor cells rated for continuous operation up to 105°C, targeting...
Read moreDetails
© EPCI - Leading Passive Components Educational and Information Site
© EPCI - Leading Passive Components Educational and Information Site