LG Innotek has demonstrated flip-chip ball grid array (FC-BGA) substrate samples that embed silicon capacitors within the package substrate for...
Read moreDetailsAlessandro Paghi, Farbod Abazar and colleagues from the University of Pisa, with contributors from Scuola Normale Superiore, CNR Nanosciences and...
Read moreDetailsFusion development creates a new capacitor opportunity. This article based on a MarketEYE analysis by Dennis M. Zogbi, published by...
Read moreDetailsMurata has introduced the DLW32SH_MF series of surface-mount common mode choke coils for noise suppression on automotive CAN and CAN...
Read moreDetailsonsemi reports that solid-state transformers (SSTs) are gaining attention as AI data centers evaluate 800 V high-voltage DC distribution architectures....
Read moreDetailsLittelfuse has expanded its TX00 tunnelling magnetoresistance (TMR) magnetic-switch family with the TX00AT314AMA, a digital omnipolar switch in a leaded...
Read moreDetailsSCHURTER has introduced the DSTH series of standard-profile through-hole DIP switches with a 2.54 mm pitch. The SCHURTER DIP switch...
Read moreDetailsTDK has expanded its CN series of low-resistance soft-termination multilayer ceramic capacitors with new 10 µF, 100 V X7R parts...
Read moreDetailsVishay Intertechnology has introduced the RAIK045I MP, a single-turn, off-axis inductive rotary position sensor encoder with 16-bit resolution, ≥ 14-bit...
Read moreDetailsHirose Electric has released the FH51 series, a 0.5 mm-pitch FPC/FFC receptacle for automotive display interconnects. The series combines a...
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