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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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Chilisin to acquire fellow inductor company

21.6.2018
Reading Time: 1 min read
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Source: Digitimes news

Power inductor specialist Chilisin Electronics has announced plans to acquire fellow company Magic Technology in a stock swap that will entail exchanging one Chilisin share for every 0.503 Magic share.

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The share-swap deal is subject to approval at both companies’ extraordinary shareholders meeting to be held on August 16, as well as relevant regulatory authorities. The share-swap record date is set at November 30.

Magic specializes in high-efficiency power inductors for motherboards and graphics cards, and has expanded its target markets to include cloud servers. Combining Magic will enhance further Chilisin’s inductor competitiveness particularly in the molding inductor segment, Chilisin said.

Chilisin recently completed its acquisition of fellow power inductor company Mag.Layer Scientific Technics through a stock swap. In 2017, Chilisin acquired chip resistor maker Ralec and ferrite cores supplier Ferroxcube, and also made an equity investment in China-based Yuanling Xianghua Electronic, a provider of inductors and ferrite materials.

Chilisin reported net profits of NT$1.48 billion (US$50.45 million) on revenues of NT$12.64 billion for 2017, with both results hitting record-high levels. EPS for the year reached NT$7.10.

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