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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

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    Würth Elektronik ABC of Thermal Management textbook

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    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

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Chilisin to acquire fellow inductor company

21.6.2018
Reading Time: 1 min read
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Source: Digitimes news

Power inductor specialist Chilisin Electronics has announced plans to acquire fellow company Magic Technology in a stock swap that will entail exchanging one Chilisin share for every 0.503 Magic share.

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Bourns Introduces Precision Thin Film Resistors for Measurement

The share-swap deal is subject to approval at both companies’ extraordinary shareholders meeting to be held on August 16, as well as relevant regulatory authorities. The share-swap record date is set at November 30.

Magic specializes in high-efficiency power inductors for motherboards and graphics cards, and has expanded its target markets to include cloud servers. Combining Magic will enhance further Chilisin’s inductor competitiveness particularly in the molding inductor segment, Chilisin said.

Chilisin recently completed its acquisition of fellow power inductor company Mag.Layer Scientific Technics through a stock swap. In 2017, Chilisin acquired chip resistor maker Ralec and ferrite cores supplier Ferroxcube, and also made an equity investment in China-based Yuanling Xianghua Electronic, a provider of inductors and ferrite materials.

Chilisin reported net profits of NT$1.48 billion (US$50.45 million) on revenues of NT$12.64 billion for 2017, with both results hitting record-high levels. EPS for the year reached NT$7.10.

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