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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Trending Tags

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    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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CMSE 2024: Technical Program Announced

21.2.2024
Reading Time: 3 mins read
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The 27th Annual CMSE Conference and Exhibition that will take place April 30th -May 2nd 2024 event in Los Angeles announces technical program.

Components for Military & Space Electronics Conference and Exhibition (CMSE) is the premier event focused on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military, as well as commercial, civilian, and military space systems.

RelatedPosts

CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

CMSE Components for Military & Space Electronics 2024 Call for Presentations

CMSE 2022 Call for Papers Deadline Extended

At this year’s event, CMSE 2024 attendees will hear everything from:

  • Next gen 2.5/3D packaging
  • Alternate grade parts
  • Plastics/COTS/Non-Hermetics
  • GaN, SiC wide gap semiconductors
  • Polymer Tantalum Capacitors
  • Supply Chain
  • Counterfeits
  • … and more…

6 slots are still available to present at this year’s CMSE Conference! The deadline has been extended to March 1st 2024. See Call for presentations.

CMSE 2024 KEYNOTES

Future Microsystems for Extreme Environments by Carl E. McCants, Ph. D., Special Assistant to the Director, Defense Advanced Research Projects Agency (DARPA) for Microelectronics Policy

The Critical Needs of a Resilient Industrial Base by David L. Beck., Branch Chief for Capability Assessment and Principal for Space (Logistics) Industrial Base for the Space Systems Integration Office, Space Systems Command (SSC), Los Angeles Air Force Base, CA

Selection from technical program related to passive components:

  • REDUCING BOARD SURFACE AREA AND IMPROVING RF PERFORMANCE BY EMBEDDING ULTRA-THIN CAPACITORS by Ryan Messina (Kyocera/AVX)
  • TIME DEPENDENT CAPACITANCE DRIFT OF X7R MLCCS UNDER EXPOSURE by Brian Ward (Vishay)
  • COUNTERING THREATS FROM TRANSIENTS IN MAGNETICS by Victor W. Quinn (Exxelia)
  • THE BENEFITS OF HIGH-RELIABILITY IN POLYMER TANTALUM CAPACITORS by Dr. James Turner (Yageo)
  • AN UPDATE ON NON-HERMETIC TANTALUM POLYMER CAPACITOR PERFORMANCE by Ron Demko (Kyocera/AVX)

See the full technical program

CMSE 2024 Technical Program

Related

Source: TJ Green Associates

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