Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    Stackpole Introduces 1400A Busbar Shunt Resistors

    Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

    Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection

    Passive Components in 2026: From Invisible Commodity to Design Parameter

    Bourns Introduces High Current Chip Ferrite Beads for Dense Power Rails

    Wk 22 Electronics Supply Chain Digest

    Vishay Releases High‑Current Radial Inductors up to 209 A

    May 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    Stackpole Introduces 1400A Busbar Shunt Resistors

    Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

    Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection

    Passive Components in 2026: From Invisible Commodity to Design Parameter

    Bourns Introduces High Current Chip Ferrite Beads for Dense Power Rails

    Wk 22 Electronics Supply Chain Digest

    Vishay Releases High‑Current Radial Inductors up to 209 A

    May 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Failure Analysis After In Orbit Anomaly On Bimetallic Thermostat

1.5.2025
Reading Time: 4 mins read
A A

This paper Failure Analysis After In Orbit Anomaly On Comepa Bimetallic Thermostat TH47 was presented by Florian Krimmel, ESA/ESTEC, Noordwijk, The Netherlands during the 5th Space Passive Component Days (SPCD), an International Symposium held from October 15th to 18th, 2024, at ESA/ESTEC in Noordwijk, the Netherlands. Published under permission from ESA SPCD organizers.

Introduction

RelatedPosts

ESA SPCD 26 Registration Open

ESA SPCD 26 Call for Papers Extended to 30th March

High-Density PCB Assemblies For Space Applications

Bimetallic thermostats are integral to spacecraft thermal management systems, ensuring the stable operation of critical subsystems.

The thermostat TH47, employed in the pressure reduction unit of a propulsion subsystem, encountered an in-orbit anomaly after months of nominal operation.

The subsequent failure analysis, conducted at the European Space Agency (ESA), sought to reproduce the anomaly under controlled conditions and identify its root causes to mitigate future risks.

Key Points

  1. Identification of temperature anomalies in the spacecraft’s propulsion subsystem linked to the TH47 thermostat.
  2. Reproduction of the anomaly on-ground through controlled thermal cycling.
  3. Discovery of contact resistance degradation leading to self-heating and functional failure.
  4. Root cause attributed to silicon-based contaminants causing contact deterioration.
  5. Implementation of an alternative thermal management strategy to maintain mission safety.

Extended Summary

The anomaly was initially detected through in-flight telemetry, revealing unexpected temperature fluctuations deviating from the thermostat’s nominal operating range of 34°C to 39°C.

The TH47 thermostat, part of a specific manufacturing lot, was suspected as the failure source. Controlled thermal cycles were conducted on samples from the same lot and more recent productions to replicate the anomaly.

The reproduction setup involved precise temperature control using Peltier elements, with meticulous monitoring of body temperature, contact resistance, and switching behavior. It was observed that after several cycles, the thermostat exhibited increased closed contact resistance, leading to self-heating. This phenomenon caused premature switching, with the thermostat turning off before reaching intended temperatures.

Further destructive analysis revealed contamination within the thermostat’s sealed environment. Residual Gas Analysis (RGA) and Scanning Electron Microscopy (SEM) identified silicon-based compounds as contaminants. These compounds degraded under electrical arcing conditions during switching events, forming insulating debris that exacerbated contact resistance issues.

The failure mechanism was linked to silicon-induced contact degradation, where arcing facilitated the breakdown of silicon compounds into non-conductive materials.

This degradation led to erratic thermostat behavior, self-heating, and ultimately, premature contact failure. The issue was isolated to thermostats from a specific manufacturing date, with newer units not exhibiting similar failures.

Conclusion

The comprehensive failure analysis successfully identified the TH47 thermostat as the root cause of the in-orbit anomaly.

The degradation of contact resistance due to silicon contamination resulted in self-heating and functional instability.

By understanding the failure mechanism, ESA implemented a revised thermal management strategy, bypassing the thermostat’s switching function while maintaining subsystem safety.

This case underscores the importance of rigorous component testing and contamination control in spacecraft systems, contributing to improved reliability in future missions.

Read the full paper:

ORAL_Day 3_38_ESA ESTEC NL_Failure Analysis on TH47 thermostatDownload

Related

Source: ESA SPCD

Recent Posts

Exxelia Extends Temperature Range of its PP Film Capacitors to 140C

1.6.2026
47

How Long-Term Storage Causes Aging in Electronic Components

26.5.2026
116

Using Stress–Strain Curves to Diagnose Tantalum Powders for Capacitors

20.5.2026
41

ESA SPCD 26 Registration Open

15.5.2026
40

Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

30.4.2026
51

Exxelia Introduces SMD High‑Voltage Mica Capacitors

28.4.2026
54

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

16.4.2026
110

KYOCERA AVX MIL-PRF-32535 BME NP0 MLCCs Approved to the DLA QPD

16.4.2026
46

ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

13.4.2026
104

Upcoming Events

Jun 16
16:00 - 17:00 CEST

EMC with EMC – EMC‑compliant design with electromechanical connectors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version