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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

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    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

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    • Ripple Current
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Taiwan Inductor Supplier Chilisin Optimistic about 2021

11.3.2021
Reading Time: 1 min read
A A

Taiwan’s inductor specialist Chilisin Electronics is optimistic about its operations this year, thanks to a significant ramp-up in demand for molding chokes for 5G infrastructure, Wi-FI 6/6E devices and automotive electronics, apart from stable demand for handset and notebook applications, according to industry sources.

Chilisin continues to maintain full capacity utilization for different sizes of molding chokes, which are popular with clients due to high price-performance ratios and compliance with current mainstream electronics designs, the sources said. The company has seen clear order visibility for molding chokes through the end of June, with delivery lead times extending to 3-4 months, the sources added.

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Its miniaturized molding chokes are mainly for handset applications, with clients including Xiaomi, Vivo, Samsung Electronics and Chinese white-box brands, the sources noted, adding the company has newly cut into the handset supply chain in India.

Its large-size molding chokes are mostly for notebooks, network equipment, datacenter servers and automotive electronics. Besides maintaining close partnerships with main Chromebook assemblers, Chilisin has become a major supplier of molding chokes for entertainment systems adopted in Tesla’s EVs and is expected to ramp up revenue contribution from automotive applications in 2021, the sources said.

Chilisin declined to comments on specific clients or orders.

Chilisin’s consolidated revenues for January and February rose 40.68% on year to NT$2.807 billion (US$100.25 million).

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Source: DigiTimes

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