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    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

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    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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WT Microelectronics Completes Acquisition of Future Electronics

9.4.2024
Reading Time: 2 mins read
A A

WT completed the acquisition of Future, strengthened its global footprint, and built a world-class global electronic components distributor with a dual headquarters structure in Taipei and Montreal.

WT Technology Co., Ltd. announced the successful completion of its US$3.8 billion acquisition of Future Electronics Inc. (“Future”).

RelatedPosts

Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

WT and Future have joined forces to create a world-class leading electronic component distributor with dual headquarters in Taipei and Montreal, creating long-term and sustainable value for all stakeholders.

The acquisition is a significant milestone in WT’s successful transformation into a world-class company, as the combination of two highly complementary business models strengthens WT’s leading position in the international market and provides more value to customers and suppliers by leveraging the strengths and expertise of both parties to provide a full range of full-service capabilities.

Wenzong Cheng, Chairman and CEO of WT, said, “We are delighted to welcome the Future Electronics team to our team, who share our passion and commitment to providing world-class services to our partners. With a broad supplier and customer base, as well as a dedicated management team and employees, we look forward to opening a new chapter for WT with all our talented colleagues around the world.” 」

Omar Baig, President and CEO of Future, said, “Our two companies share a common culture and an entrepreneurial spirit, which enables our employees around the world to do their best work. As part of WT, we will continue our long-term strategy to provide the highest level of service to our suppliers and customers, as we have for the past 56 years. 」

WT and Future look forward to this new era and continue to serve their business partners around the world.

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Source: WT Microelectronics

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