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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

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    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

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    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

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Würth Elektronik Unveils Stick-on EMC Shielding

27.8.2024
Reading Time: 1 min read
A A

Würth Elektronik launches its hybrid WE-EMIP EMI absorber sheet, a convenient solution for preventing electromagnetic interference.

The integrated adhesive layer makes the patch easy to stick on. It offers high attenuation exceeding 40 dB over a wide frequency range.

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Both isolated and non-isolated versions are available. The non-isolated version allows the option of earthing.

The absorber patch is simply stuck to the component to be protected or the source of interference. The hybrid absorber sheet consisting of EMI absorber material and aluminum layer is now available in the following sizes: as a sheet 105 × 74 mm, 297 × 210 mm or as a roll 15 m × 50 mm.

Würth Elektronik offers a product to get EMC problems associated with radiated emission under control in an easy way and to protect sensitive components. The patch offers up to 12 times higher attenuation than previously available absorber sheets and helps achieve attenuation values otherwise attainable only with shielding cabinets.

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