Failure Analyses

The fact that a component is mounted on a board does not necessarily reduce its ability to be imaged and...

Francisco Javier Aparicio Rebollo, Alter Technology's Senior Materials and Test Engineer is introducing overview of non-destructive inspection of electronic components...

"Failure analysis of capacitors and inductors" article by Javaid Qazi and Masahai Ikeda from KEMET Electronics appeared in ASM International®...

Source: Alter Technology article by Francisco Javier Aparicio Rebollo, Senior materials and Test Engineer at Alter Technology. X-ray photoemission spectroscopy...

Source: Alter Technology article by Francisco Javier Aparicio Rebollo The Fluorescence Microscopy + dye penetrant test is a technique that...

This article explains common component soldering process issues on passive electronic components such as chip capacitors and resistors during board...