Failure Analyses

e-PassiveBlog / Failure Analyses / Reliability & Obsolescence / Test & Measurement

Photoemission spectroscopy XPS how it works and assist in EEE parts analysis

By Alter Technology Posted On 6.6.2019

Source: Alter Technology article

by Francisco Javier Aparicio Rebollo, Senior materials and Test Engineer at Alter Technology.

X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. (more…)

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Capacitors / e-PassiveBlog / Failure Analyses / Inductors / Reliability & Obsolescence / Resistors / Test & Measurement

Fluorescence Microscopy + dye penetrant test on EEE Parts

By Alter Technology Posted On 1.10.2018

Source: Alter Technology article

by Francisco Javier Aparicio Rebollo
The Fluorescence Microscopy + dye penetrant test is a technique that combines two inspection methods commonly used for the detection of surface anomalies such as cracks, porosity, laps, delaminations, and other discontinuities. (more…)

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