Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

8.7.2026
Reading Time: 10 mins read
A A

Higher switching frequencies and tighter power-density targets are reshaping inductor design across server, industrial and automotive power electronics. NANOMET soft magnetic material from YAGEO KEMET addresses that shift by combining high saturation capability, temperature-stable behavior and reduced dependence on large external air gaps, making it relevant for compact inductors in high-current and high-frequency converter stages.

As converter designers push beyond traditional ferrite comfort zones, the limiting factor is increasingly the complete inductor loss balance rather than a single magnetic parameter. In that context, YAGEO NANOMET stands out as a material platform aimed at improving the trade-off between core loss, copper loss, size and EMI.

RelatedPosts

KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

YAGEO Expands Aluminum Polymer Capacitors for High-Temperature AI Server Power Rails

YAGEO Adds X8 Flexible-Termination Automotive MLCCs for 150°C Designs

Why this material matters

The move to GaN- and SiC-based power conversion has increased the pressure on magnetic components to deliver more power in less volume. In many designs, switching frequencies now extend into the several-hundred-kilohertz range, while multiphase buck regulators for high-performance processors operate around 1 MHz.

That trend changes the way inductors must be evaluated. Downsizing a magnetic component with a conventional material often increases core loss and makes thermal management harder, especially where magnetic flux density and current ripple are both high. A more suitable core material can therefore unlock not just smaller magnetics, but a better system-level efficiency and cooling balance.


Figure 1. Increasing power density in modern server applications.

Core behavior and practical implications

The key material parameters are permeability, saturation behavior and frequency-related loss. Permeability determines how much inductance can be achieved for a given geometry, while saturation behavior defines how far the inductor can be pushed before inductance starts to collapse under current load.

In practical power inductor design, ferrites often require a discrete air gap to avoid abrupt saturation. That solves one problem, but creates others: flux leakage, fringing losses, EMI challenges and added volume. A material with softer saturation behavior and a more distributed internal gap structure reduces those penalties.

The core-loss plot is especially relevant in high-frequency converter design, while the B/H curve shows why the material can be attractive where designers need usable inductance under high current without a strongly leaky external gap.

Key features and benefits

  • High saturation capability supports demanding DC bias conditions in compact inductors.
  • Temperature-stable magnetic behavior helps maintain predictable inductance under thermal stress.
  • A practical permeability level around 100 suits power inductor design without the large external air gap typically used in ferrite implementations.
  • Reduced air-gap dependence lowers fringing-field effects and can improve EMI behavior.
  • Shorter winding structures and fewer turns can reduce DCR and copper losses.
  • The material is suited to both low-inductance high-current parts and larger high-power choke designs.

Material positioning against ferrite and metal composite

NANOMET does not replace every existing soft magnetic material, but it does fill an important performance window between ferrite and conventional metal composite solutions. Ferrites remain attractive where very low core loss dominates the design target, while metal composites remain useful in some compact molded designs. NANOMET becomes particularly relevant where high saturation margin, manageable core loss and compact size must all be met together.

Material familyFerritesMetal compositeNANOMET
CompositionMn-ZnFeSiCrFeSiBPCuCr
ProcessPowder mold sinteringPowder mold curingHot mold
Permeability μ900, usually reduced by gap in use25100
Bc0.5 T1.2 T1.3 T
μ versus temperatureNot stableStableStable
Relative core lossLowHighMid

Air-gap reduction as an EMI and thermal advantage

Large external air gaps are often accepted as a normal part of ferrite inductor design, yet they are also a common source of local field leakage. That leakage can drive fringing losses in nearby conductors and increase radiated or coupled noise in dense converter layouts.

Every core material has process foundations that lead the way to mechanical inductor designs. While typical metal composite materials can be processed to form a core around a coil specifically for surface-mounted power inductors, the process for ferrites and NANOMET™ dictates forming a solid block shape first and assembling the coil afterwards. The process conditions of those materials require enormous pressure and heat that would soften electrical isolation materials and can cause deformation, which is called “Hot Press Molding” technology.


Figure 7 – Typical NANOMET™ core shapes used that can be manufactured

Metal composite and NANOMET™ inductors have a built-in airgap structure in the material that ensures each metal powder grain is coated with a Silicon shell, which represents the magnetic gap. Ferrite designs typically need to operate with an air gap to avoid saturation by applied current. An air gap allows the magnetic field to leak through the whole design and can cause EMI challenges. The field leakage also causes fringing losses to structures close to the winding. In high-power designs, this can introduce a significant amount of heat in the conductor.

With some core designs, even metal composite or NANOMET™ component structures require minimal airgaps to increase the saturation capability or cater for the required mechanical conditions that the application demands and the core assembly process dictates. In any case, the gap is smaller with iron-based silicon-coated materials, and the impact of EMI emission and fringing losses is much less.


Figure 8. Influence of air gaps in power inductor designs.

This explains why air-gap architecture is not just a material-science detail. In practical designs, a smaller or internally distributed gap can reduce both EMI and localized heating near the winding, particularly in high-current storage inductors.

Typical applications

The material is relevant across several distinct inductor classes. It spans both low-inductance, very high-current parts and higher-inductance, higher-power choke designs:

  • Multiphase buck regulator power beads for CPUs and GPUs.
  • TLVR inductors for faster transient response in processor power delivery.
  • PFC and boost inductors in higher-power AC/DC conversion.
  • PCB-mount SMD power inductors for dense local power stages.
Figure 9. Examples of component shapes.

#1 Power bead case study: 90 nH in a server VR environment

In low-inductance, high-current server regulator stages, inductor volume, DCR and saturation current all directly affect efficiency and thermal headroom. A 90 nH comparison shows that a NANOMET power bead in the same basic footprint class can deliver lower DCR, lower total loss and a lower component height than a ferrite alternative, while also improving saturation current.

The relevant engineering takeaway is that total inductor loss matters more than isolated core loss. Even where ferrite may retain an advantage in one loss component, the shorter winding and lower copper losses of a NANOMET-based design can produce a better overall result, especially as current rises.

#2 TLVR case study: faster transient response with smaller magnetics

Transient load voltage regulator architectures are designed for extremely fast current slew during CPU and GPU load steps. In this environment, inductors must support both dynamic response and manageable efficiency.

The comparison points to lower DCR and lower profile for the NANOMET version, alongside a favorable total-loss result. This makes the material attractive where board density and transient performance must improve together without accepting a large EMI penalty from a gapped ferrite structure.

#3 PFC choke case study: compact magnetics at higher power

The material case becomes even more interesting in larger front-end magnetics. In PFC or boost inductors, designers need to control core loss while also meeting mechanical volume and thermal limits.

In this application space, the attraction of NANOMET is its ability to support compact choke geometry while still meeting inductance and loss targets at elevated switching frequency. The data also reinforces a realistic design rule: even with a strong core material, winding losses remain important and must be paired with an effective thermal extraction path.

#4 SMD inductor case study: 150 nH PCB-mount design

For compact local power conversion, DCR and saturation current are often the first two filters in part selection. In the 150 nH SMD comparison, the NANOMET example achieves much lower resistance and significantly higher saturation current than the compared METCOM parts at similar nominal inductance.

This makes the material relevant not only for very high-end server hardware, but also for smaller DC/DC stages where every square millimeter and every milliohm matter.

Design-in notes for engineers

  • Evaluate performance at the complete inductor level, not only from raw core-loss curves.
  • Compare DCR, saturation current, package height and EMI impact together when benchmarking against ferrite designs.
  • In high-current designs, expect copper losses to dominate more strongly as load rises, which can favor shorter winding structures.
  • In PFC and boost applications, include the thermal path in the first design iteration rather than treating it as a later mechanical fix.
  • Confirm exact ratings, dimensions and qualification details in the latest datasheet when selecting production parts, especially where the article examples are based on comparison platforms rather than a full commercial part-number table.

Source

This article is based on an official YAGEO KEMET technical release covering NANOMET soft magnetic material, its material characteristics and four application comparisons spanning power beads, TLVR inductors, PFC chokes and compact SMD power inductors.

References

  1. YAGEO KEMET — NANOMET™: Soft Magnetic Material Evolves to Achieve Benchmark Power Conversion Performance
  2. YAGEO Group official website

Related

Recent Posts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
5

Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

3.9.2026
14

B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

31.8.2026
34

Vishay IFBT SMT Flyback Transformers Target PoE and Isolated DC/DC Designs up to 30 W

28.8.2026
20

Bourns Automotive BMS Signal Transformer Combines Reinforced Isolation and Common-Mode Noise Rejection

27.8.2026
27

Vishay Introduces Automotive Low Loss SMD Common-Mode Chokes

26.8.2026
33

Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

24.8.2026
43

Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

20.8.2026
125

Single Pair Ethernet for Humanoid Robot In-Robot Networks

17.8.2026
179

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved