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    Würth Elektronik Releases Long Life SMT nano and microSD Card Connectors

    Glass Core Technology Breakthrough Potential for High-Speed Interconnects

    YAGEO Releases High Isolation Transformer for 1500VDC Applications

    Bourns Releases 1500VDC Power Fuse for Photovoltaic Applications

    Murata Releases Worlds First Molded Thermistor with Wire-Bonding

    Vishay Extends Axial Wirewound Resistors with WSZ Lead Form

    Smoltek CNF-MIM Capacitor Commercialization Update

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    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

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    How to design a 60W Flyback Transformer

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Exxelia Smart Magnetics Enhancing Next-Generation Resonant and Bidirectional Power Converters

26.6.2024
Reading Time: 3 mins read
A A

Exxelia, global manufacturer of complex passive components and subsystems introduces groundbreaking innovations in smart magnetics technology, specifically tailored for resonant bidirectional power converters.

These advancements are set to redefine efficiency and performance standards across a spectrum of applications.

RelatedPosts

Exxelia to Present Smart Integrated Magnetics and MML Film Capacitors at SIAE25 

Exxelia Power Film Capacitors Support Critical Systems Across Various Industries

Exxelia Showcases new Integrated Magnetics, SVM Bus Bars at PCIM Europe 2025

The advent of electrification, especially in electric or hybrid mobility including EVTOLs, buses, heavy vehicles, military/defense applications, off-road vehicles, and space thrusters, as well as electric energy storage systems & Smart Grid networks, implies the management and storage of large quantities of electrical energy.

This necessitates the use of specific architectures such as DAB, LLC, and interleaved converters. These structures enable very high efficiencies.

EXXELIA SMART MAGNETICS INTEGRATED TECHNOLOGY

Combines an inductor and a transformer into a single ultra-compact/miniaturized, lightweight component, regardless of the inductance value, for a seamless integration.

Features

  • High Power Applications (up to 300kW)
  • High Frequency (10-500kHz): fits next-generation semiconductors (SiC, GaN) : Enables compact, lightweight designs.
  • High Efficiency: minimizing losses, achieving efficiencies above 99% even at high frequencies.
  • Lower Total cost of ownership: Ensuring straightforward integration and optimized system costs.
  • EMI Reduction: Enhances electromagnetic compatibility for reliable operation.

TECHNICAL CHARACTERISTICS

3 Phase 24 kVA Integrated Component (Transformer + Inductors) 360/27 V @ 100kHz.

Dual Active Bridge Transformer 2kW / 10:1 / 300 kHz and Chokes 10µH

Meet the Challenges in Converter Development:

  • Miniaturization: Designing smaller systems without compromising performance.
  • Thermal Management: Efficiently managing heat to enhance durability and efficiency.
  • Cost-Effectiveness: Balancing efficiency enhancements with cost-effective solutions.

Exxelia’s commitment to the development of these new technologies shows its willingness to anticipate the needs of advances power electronics.

This project was financed by the government as part of the Recovery plan

Related

Source: Exxelia

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