MLCCs in the Age of AI: Q2 2026 Market Tightness
This overview article summarizes the global MLCC market in Q2/2026, outlines the roles of major manufacturers across Japan, Korea, Taiwan, ...
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AI Hardware Demand for Passive Components Dossier
Passive Components Blog has published its AI Hardware Passive Components Dossier 06/26 technical and market report. It is a compact, ...
June 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s latest IP&E update indicates that the broad-based recovery across the market is still gaining traction, with Agentic AI ...
KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design
Kyocera AVX presents Antenna Integrator Studio (AIS) is a browser-based tool for selecting antennas and optimizing their integration into a ...
Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization
Simulation tools such as REDEXPERT and eDesignSuite are increasingly central to modern power converter design workflows, because they let engineers ...
Wk 25 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-26-26. DATAPOINT OF THE WEEK: May new car registrations in Europe totaled 1.15M, surpassing the 1M ...
Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers
Skeleton Technologies has announced a new supercapacitor that achieves a UL 810A‑certified peak current of 3,500 A in a volume ...
Bourns Planar Transformers for SiC and GaN Gate Driver Isolation
Bourns SM9127AL planar isolation transformers help cut EMI in modern SiC and GaN gate‑driver PSUs by turning PCB geometry into ...
100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms
VINA Enesol, part of VINATech group, has introduced a 100 V hybrid polymer aluminium capacitor targeting next‑generation 48–72 V DC ...
Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes
Panasonic’s new HE‑S SC relay family is a compact PCB relay solution designed as the main switching element in next‑generation ...
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