Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Murata Integrates Component Models into Cadence EDA Tools

    Wk 42 Electronics Supply Chain Digest

    Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

    September 2025 ECIA US Components Sales Sentiment Continues in Optimism

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Murata Integrates Component Models into Cadence EDA Tools

    Wk 42 Electronics Supply Chain Digest

    Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

    September 2025 ECIA US Components Sales Sentiment Continues in Optimism

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 3 Electronics Supply Chain Digest

20.1.2025
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 1-17-25.

DATAPOINT OF THE WEEK: China has launched an investigation into US subsidies, claiming they give companies like Texas Instruments and Analog Devices an unfair advantage in the mature node chip market, harming Chinese chipmakers.

RelatedPosts

Wk 42 Electronics Supply Chain Digest

Wk 41 Electronics Supply Chain Digest

July 2025 Interconnect, Passives and Electromechanical Components Market Insights

The probe targets the CHIPS Act, alleging that US firms are exporting low-priced chips to China, undermining the local market. The investigation follows complaints from Chinese industry players, who argue that the $39B in funding under the CHIPS Act violates market principles and disrupts global supply chains.

Beijing’s move mirrors concerns raised by the US and EU about state subsidies and the potential for market flooding with low-cost chips.

Headlines:

Auto/Transportation

  • Slight increase in material costs expected to stabilize BEV cell prices in 1Q25, says TrendForce
  • Chinese buyers interested in unwanted German Volkswagen factories
  • Car plants in Europe, North America face closures in 2025, Gartner says 
  • Global sales of EVs and PHEVs rose 25.6% Y/Y in Dec, reaching 1.9M units
  • German premium carmakers’ sales battered in China and Germany amid slowdown
  • US new vehicle sales surged in Dec, with a 6.5% increase M/M, Cox Automotive
  • Mercedes-Benz and Google partner on AI-powered conversational search within navigation systems
  • Stellantis projects 9% shipment decline for Q4 amid US inventory cuts
  • US EV sales set a record in 4Q24, rising 15.2% Y/Y, Cox Automotive
  • Volkswagen deliveries drop in tough year at home and in China

Datacenter

  • HPE secures $1B AI server deal with Elon Musk’s X social network
  • Inventec eyes Texas for US server factory, awaits clarity on tariff policy
  • Nvidia’s biggest customers delaying orders of latest AI racks, The Information reports

Semiconductors

  • Analog Devices receives $105M CHIPS Act award
  • Qualcomm and NXP drive AI integration in consumer and automotive electronics at CES 2025
  • Infineon breaks ground on power module assembly plant in Thailand
  • NXP gets €1B loan from EIB for European projects
  • NXP could make up to 10% of revenue from India by 2030
  • Global chipmakers reduce investments for 2nd year in a row as EV and smartphone demand stalls
  • STMicroelectronics and GlobalFoundries reportedly halt French wafer plant plans, shift focus to Chinese market
  • TSMC begins 4nm chip production in Arizona, a first for the US
  • US Department of Commerce announces $1.4B to support semiconductor advanced packaging
  • US introduces tiered AI chip export rules, restricting China and prioritizing allies

Consumer/Other

  • China’s dual-use export controls disrupt supply chain relocation, affecting Apple and ODMs
  • Tech giants Meta, Microsoft, and Amazon plan job cuts in early 2025
  • US importers rush in goods from China as Trump tariff threat looms

Related

Source: Edgewater Research

Recent Posts

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

22.10.2025
1

Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

22.10.2025
2

Molex Acquires Smiths Interconnect

21.10.2025
2

Wk 42 Electronics Supply Chain Digest

20.10.2025
15

Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

20.10.2025
6

September 2025 ECIA US Components Sales Sentiment Continues in Optimism

20.10.2025
11

Bourns Release Automotive 4-Terminal Shunt Resistors

17.10.2025
18

Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

16.10.2025
12

YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

13.10.2025
138

KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

13.10.2025
24

Upcoming Events

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version