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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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Wk 44 Electronics Supply Chain Digest

30.10.2023
Reading Time: 5 mins read
A A

Electronics Supply Chain Weekly Digest 10-27-23.

DATAPOINT OF THE WEEK: S&P reported Eurozone Oct flash PMI of 43.0 vs. 43.4 in Sept signaling an accelerating downturn at the start of the 4th quarter with a steeper rate of contraction across orders and output. In Germany Oct flash mfg. PMI at 40.7 vs 39.6 in Sep indicated the contraction in the sector continued, albeit at a slightly less severe rate. For Japan S&P reported Oct flash mfg. PMI of 47.6 vs 48.7 in Sep indicating worsening conditions. For the US S&P reported Oct flash PMI of 50 vs. 49.8 in Sep, marking a 6-month high, and signaling a stabilization in operating conditions. S&P noted further improvement in supplier performance and still soft demand led firms to cut their input buying for the fifteenth month running in October.   

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Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 33 Electronics Supply Chain Digest

Headlines:

Auto

  • October China retail car sales flat M/M, +10% Y/Y; NEV up 1% M/M, 35% Y/Y
  • Denso to invest $3.3B in semiconductors by 2030; to triple scale of its IC business by 2035
  • More alarm bells for EVs with GM and Honda scrapping plans for $5B JV
  • BP has ordered $100M of Tesla’s ultra-fast chargers
  • New car sales in Europe up 11% in September; growth across all segments rapidly decelerating on weak BEV sales in Germany
  • GM loses self-driving license in California; grounds entire fleet  
  • Ford and UAW reach tentative labor deal; UAW to use as a template against GM and Stellantis
  • UAW expands strike to GM and Stellantis most profitable assembly plants
  • Ford with weak 3Q results; removes full year outlook despite UAW deal; to delay $12B of previously announced EV investments
  • Mercedes describes current EV market as “brutal”, pressuring car sales margins
  • Hyundai wont delay EV launches but warns 2024 sales to be lower than expected
  • Stellantis buys 20% of Chinese EV maker Leapmotor; gains rights to sell Leapmotor EVs outside China
  • Tesla increased Model Y price in China by $2000 on Friday
  • VW cuts profitability targets, notes EV order intake cut in half
  • Automakers blast US plan to hike fuel efficiency rules
  • US SAAR projected to inch higher M/M and Y/Y in October says Cox Automotive

Datacenter/Telco

  • Apple plans to spend $1B per year on generative AI products
  • US cloud spending showing signs of stabilization with Microsoft cloud sales reaccelerating in 3Q
  • China rushes to swap Western tech with domestic options as U.S. cracks down
  • Ericsson sees demand uncertainty stretching into 2024; notes demand from India was pulled forward in 2023
  • Microsoft to invest $5B to build nine new datacenters in Australia

Semiconductors

  • Asian Himax and Nexchip team up to supply ICs to the EV market
  • GlobalWafers looking to acquire SiC and GaN companies
  • Infineon has closed the acquisition of GaN Systems
  • Intel reports better 3Q results; sees PC as bottoming; server sales uptick on ASP; FPGAs weaker
  • Taiwan OSAT reportedly seeing mild increase in fab utilization to start 4Q
  • onsemi completes the expansion of its SiC wafer facility in Korea capable of +80k WSPM
  • onsemi and Renesas collaborate to improve performance and safety of autonomous vehicles
  • Microchip doubles its Detroit Automotive Technology Center
  • Nvidia to make Arm-based PC chips in major new challenge to Intel
  • US administration updates export restriction rules for AI chips impacting Nvidia A800/H800
  • Japanese semi equipment sales continue to deteriorate in Sep, declining 20% Y/Y
  • China SiC wafer share expected to reach 50% in 2024 according to Asian reports
  • ST Micro sees continued strength in Auto demand but notes weakness in Industrials
  • TI surprisingly cuts wafer starts as inventory piles and outlook projects continued weakness
  • TSMC founder warns US China tensions could slow global semi markets
  • TSMC considering a $2B 12-inch fab in Singapore for automotive customers
  • UMC sees wafer shipments down 5% in 4Q as PC and Mobile customers remains conservative while automotive demand turns more challenging
  • Western Digital and Kioxia brake off talks to merge according to Nikkei
  • Global wafer shipments to decline 14% in 2023 says SEMI

Consumer/EMS/Distribution

  • Apple iPhone 15 selling far worse in China than predecessor according to two reports
  • Global smartphone contracted by 8% to the lowest 3Q in a decade says Counterpoint

Related

Source: Edgewater Research

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