After the successful introduction webinar, we now delve deeper into the physics and statistics of the Interconnect Stress Test (IST).
We will compare the IST with the well-known temperature cycle test (TCT) and demonstrate the possibilities of statistical analysis.
The following topics are discussed in detail in the webinar:
- Failure modes and their causes
- Evaluation and presentation of the results of reliability proof
- Possibilities for optimisation
- Factors influencing the reliability of PCBs
Source:
Würth Elektronik
