The Modelithics Library for MathWorks MATLAB provides an extensive set of high‑accuracy, measurement‑based models for RF, microwave...
Bourns has released four new multilayer chip inductor series – CE0603G, CE0603M, CE1005Q and CE1608Q – aimed...
A Penn State–led team has developed a new polymer “alloy” capacitor film that stores up to four...
ECIA’s January 2026 survey signals the strongest sales sentiment for the electronic components industry in more than...
Vishay’s new CRCW0201-AT e3 series extends the company’s thick film chip resistor portfolio into the ultra-compact 0201...
Coilcraft’s CMA family is a series of automotive‑qualified surface‑mount common mode chokes designed for EMI suppression in...
AI server demand is rapidly absorbing high‑end MLCC capacity and manufacturers are considering price increase of the...
YAGEO Group has introduced three new antennas that target high‑reliability wireless connectivity and precision positioning: a compact...
SCHURTER’s USE 2410 is a quick-acting, wire-in-air surface‑mount fuse in the compact 2410 footprint, designed for both...
TDK has extended its NTCSP chip thermistor family with new automotive‑grade parts qualified up to 175 °C...
Researchers at TU Wien have developed a high‑aspect‑ratio superconducting vacuum gap capacitor NEMS structure with plate distances...
Power electronics teams entering 2026 face tighter space, efficiency and time‑to‑market constraints, while magnetics must still behave...
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© EPCI - Leading Passive Components Educational and Information Site