Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

March 2025 Interconnect, Passives and Electromechanical Components Market Insights

31.3.2025
Reading Time: 3 mins read
A A

Edgewater researchers encouraged that IP&E fundaments have bottomed, and the industry is returning towards shipping to consumption which ultimately supports our mid-single digit growth outlook for the year. March 2025 collection of news summaries, survey results, and channel market insights on Interconnect, Passives components & Electromechanical Components from Edgewater Research. 

AI Outlook Still Robust Despite Roadmap/Content Changes, Broader Market Trends Showing Signs of a Rebound

RelatedPosts

Wk 38 Electronics Supply Chain Digest

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 37 Electronics Supply Chain Digest

What’s Changed/What’s New?
1. Global demand trends improving, with upside in 1Q shipments and uplift in sentiment regarding cyclical recovery. 
2. Orders trends outperforming shipments driving B2Bs above parity in every geo. Demand seen strengthening in Mil/Aero, improving in pockets in Industrial and mass market, remaining strong in IT datacom, and stabilizing in Auto in the West. 
3. Improving demand seen primarily driven by normalizing inventory downstream and conservative end customer forecasting.
4. Distribution inventory seen as approaching lean levels for connectors and some electrotechnical on improved sell-through, driving increasing replenishment by private distis. Lead times for certain interconnect, relays and tantalum capacitors seen pushing out. 
5. Full year forecast seen as little changed despite near-term upside and improving trends. Sentiment seen shifting to cautious optimism capped by uncertainty tied to potential demand pull forward and tariffs, geopolitical uncertainty.

Top 4 Channel Comments:
• In Asia, we had the best disti bookings 2 months in a row since 2022 with POS also improving. Demand seems driven by smaller customers and Auto as inventory has been cleared and there is concern about supply. 
• As of early March, 65% of our 2Q target is booked. While last year’s 1Q strength in Europe faded, 1Q25 is outperforming 1Q24, with Europe inventory down 25% Y/Y. We’re cautiously optimistic about a real recovery.
• Major AI customers are asking us to ramp and ship as soon as we can. The connector demand normally leads system builds by 2-3 months. We see sequential growth in connector overweight in 1H25 with potential adjustments to 2H demand based on system builds.
• Nvidia’s Kyber architecture uses a midplane PCB with board-to-board connectors connecting the GPU and the NVSwitch trays in a canister. However, the 4 canisters still need to be connected so all the GPUs can talk. Nvidia hasn’t figured out yet how to do it but that will likely involve DAC or AEC. The number of cables is likely to be less but it’s unlikely that Nvidia eliminates all cables entirely.

Other Key Takeaways:
6. AI demand forecasts unch. at +40% with growth skewed to 1H on supply assurance; 2H seq. growth contingent on system builds. 
7. Nvidia GTC product announcement seen creating IP&E content opportunities; increased power consumption driving demand for passives; Nvidia remaining committed to copper for scale up applications through 2H27 with content also trending up on projected increase in data rate and GPU density. 
8. Nvidia GB system forecast unchanged at ~30K, still contingent on smooth design/test/ramp of GB300 in 2H. 
9. Hyperscale and enterprise customer seen increasing their due diligence on suppliers, system designs and architectures given going supply chain/manufacturing/reliability challenges with cabled backplanes at several AI customers. 
10. Industrial demand trends seen as improving from distis globally and select direct customers in Europe. Auto trends in the West seen as stabilized for a second consecutive month; China Auto demand viewed as remaining strong with continued Y/Y growth.

Conclusion:
IP&E fundamentals continued to show signs of improvement in March.

IT Datacom remains a key near term driver of growth, however in February and March, we have seen more signs of cyclical improvements from the broad markets in distribution and Industrial.

The Aerospace, Defense & Military market remains robust, and we are seeing signs of stability most notably within the Automotive market in EMEA. While the industry is encouraged by the near-term improvements, the overarching view remains cautiously optimistic as this downturn has been plagued with several false starts.

We remain encouraged that IP&E fundaments have bottomed, and the industry is returning towards shipping to consumption which ultimately supports our mid-single digit growth outlook for the year.

Full report available from: Dennis Reed, Sr. Research Analyst, Edgewater Research

Related

Source: Edgewater Research

Recent Posts

Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

TT Electronics: Resistor and Sensing Trends at electronica 2026

9.10.2026
3
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
5
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
20
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
5
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
18
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
20
Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

7.10.2026
13
Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

TDK Expands1608 Inductors for Automotive PoC Filters

6.10.2026
8
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
38

Upcoming Events

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved