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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

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    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

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Modelithics Adds Over 100 Models to COMPLETE+3D Library for Ansys HFSS

29.2.2024
Reading Time: 2 mins read
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Modelithics is pleased to announce the release of the Modelithics COMPLETE+3D Library v24.0 for Ansys HFSS.

This release includes approximately 120 new models, representing over 1,500 additional components, and is now compatible with Ansys HFSS 2024 R1.

RelatedPosts

Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

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With this release, Modelithics COMPLETE+3D Library now represents over 26,000 components from 70+ vendors. The release is backward compatible with previous Modelithics library releases.

Within this release over 90 new electromagnetic (EM) HFSS 3D Components are available in geometry models and 3D Brick EM Models™ formats for many company manufacturers, including new models for Amotech, Johanson Technology, Kyocera-AVX, Samsung, Taiyo Yuden, Vishay and many more!

New 3D EM models are available for Tecdia single-layer ceramic capacitors as well as Murata inductors. As part of this library release, Modelithics is introducing a new 3D Brick EM model format that is compatible with Ansys HFSS 3D Layout.  Modelithics 3D Brick EM Models combine the best of both 3D and circuit simulation techniques and are for use with capacitors.

Also available with this release, are over 25 new Microwave Global Models for capacitor, inductor, and resistor families for Dalicap, Johanson Technology, Murata, Piconics, Susumu, TDK, Voltronics and Würth Elektronik. Modelithics Microwave Global Models are powerful measurement-based models that are highly scalable. Designers can specify a desired substrate and solder-pad dimensions and the model will then scale accordingly. Microwave Global Models also scale with respect to part values, making them ideal for tuning and optimization.  

Through the Modelithics Vendor Partner (MVP) program, FREE 90-day use of Modelithics models for Amotech, Dalicap, Kyocera-AVX, Piconics, Susumu, Tecdia and Vishay components are available. For more information or to request free use of the new models for these MVP’s or other available Modelithics MVP sponsored models, please visit www.modelithics.com/MVP.

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Source: Modelithics

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