Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    DigiKey Releases Season Two of Sustainable Futures Series

    Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

    Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    EMC‑Compliant PCB and Connector Design Guidelines

    Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    DigiKey Releases Season Two of Sustainable Futures Series

    Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

    Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    EMC‑Compliant PCB and Connector Design Guidelines

    Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Murata Announces Mass Manufacturing of World’s First 0402 47µF MLCC

10.7.2025
Reading Time: 2 mins read
A A

Murata Manufacturing Co., Ltd. has begun the world’s first mass production of the 0402-inch size (1.0 × 0.5 mm) multilayer ceramic capacitors (MLCC) with a capacitance of 47µF.

The new product line, available in two variants with different temperature characteristics, is designed to advance MLCC miniaturization and enhance customer system performance.

RelatedPosts

Murata Expands Ansys Simulation Models for RF inductors, MLCCs, and Power Inductors

Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive

Murata and Xona Partner on LEO Satellite Navigation for Industrial Applications

In recent years, high-performance IT solutions, such as those used in AI servers and data centers, have seen rapid growth. Due to the often high component density demanded by these devices, optimized component placement within limited PCB areas is paramount.

As a result, there is increasing demand for capacitors that offer both miniaturization and higher capacitance, along with high reliability under high-temperature conditions caused by heat generated from PCBs and integrated circuits (ICs).

In response to these requirements, Murata has utilized its proprietary technologies in ceramic dielectric layers and internal electrode miniaturization to facilitate the world’s first mass production of this innovative 47µF product in the compact 0402-inch size.

Compared to Murata’s conventional 0603-inch size product with the same capacitance, this new capacitor reduces mounting area by approximately 60%. Additionally, it delivers about 2.1 times the capacitance of Murata’s previous 22µF product in the same 0402-inch size. 

The MLCC is available in two variants – the X5R (EIA) GRM158R60E476ME01 with an operating temperature range of -55 to +85°C, and the X6S (EIA) GRM158C80E476ME01 with an operating temperature range of -55 to +105°C.

The ability to operate in environments up to 105°C, makes the X6S variant well-suited for placement near ICs, thereby contributing to improved device performance and integration. Both devices feature a ±20% tolerance and rated voltage of 2.5Vdc.

Murata is committed to advancing miniaturized capacitors with higher capacitance and improved high-temperature reliability to meet evolving market demands. These innovations not only support the ongoing miniaturization and functional enhancement of electronic devices but also contribute to lower material usage and increased production efficiency per unit, ultimately helping reduce power consumption at Murata’s factories and lessen environmental impact.

Related

Source: Murata

Recent Posts

Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

24.6.2026
14

Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

23.6.2026
11

High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

23.6.2026
40

Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

22.6.2026
23

Knowles Expands High‑Q Ceramic Core Inductors for RF designs

19.6.2026
23

TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

18.6.2026
110

Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution

17.6.2026
44

Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

17.6.2026
32

YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

17.6.2026
30

Upcoming Events

Jun 30
17:00 - 18:00 CEST

PSMA Capacitor Committee Webinar: High Voltage Pulse Capacitors

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version